Quantitative polynomial free energy based phase field model for void motion and evolution in Sn under thermal gradient

Anil Kunwar, Michael R. Tonks, Shengyan Shang, Xueguan Song, Yunpeng Wang, Haitao Ma

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

As the electronic packaging and fabrication industries for solar PV cells assembly or panels are making endeavours in using Pb-free solder joints, the reliability of these joints can be taken as an important research topic. Among several aspects, the control of void formation, growth and evolution in lead-free Sn-based solders can be achieved if the underlying mechanism for such phenomena can be modeled. This study employs a quantitative polynomial free energy based phase field method to model the motion and evolution of void in Sn material under thermal gradient. The effects of imposed temperature gradient to the overall migration rate and profile of the void has been assessed in the finite element model.

Original languageEnglish (US)
Title of host publication18th International Conference on Electronic Packaging Technology, ICEPT 2017
EditorsChenxi Wang, Yanhong Tian, Tianchun Ye
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1502-1507
Number of pages6
ISBN (Electronic)9781538629727
DOIs
StatePublished - Sep 19 2017
Event18th International Conference on Electronic Packaging Technology, ICEPT 2017 - Harbin, China
Duration: Aug 16 2017Aug 19 2017

Publication series

Name18th International Conference on Electronic Packaging Technology, ICEPT 2017

Other

Other18th International Conference on Electronic Packaging Technology, ICEPT 2017
CountryChina
CityHarbin
Period8/16/178/19/17

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All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys
  • Polymers and Plastics
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Kunwar, A., Tonks, M. R., Shang, S., Song, X., Wang, Y., & Ma, H. (2017). Quantitative polynomial free energy based phase field model for void motion and evolution in Sn under thermal gradient. In C. Wang, Y. Tian, & T. Ye (Eds.), 18th International Conference on Electronic Packaging Technology, ICEPT 2017 (pp. 1502-1507). [8046720] (18th International Conference on Electronic Packaging Technology, ICEPT 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT.2017.8046720