Reaction kinetics and thermal properties of epoxidised cresol novolac/4,4'-diglycidyl (3,3',5,5'-tetramethylbiphenyl) epoxy resin composite cured with aromatic diamine

Zhongguo Liu, Gang Zhang, Kuifeng Tu, Sen Zhao, Miaomiao Han, Jing Ni, Wenjia Ma, Hui Na

Research output: Contribution to journalArticle

3 Scopus citations

Abstract

A series of novel composites based on different ratios of epoxidised cresol novolac (ECN) and 4,4'-diglycidyl(3,3',5,5'-tetramethylbiphenyl) epoxy resin (TMBP) have been prepared with the curing agent 4,4'-methylenediamine (DDM) and 4,4'-diaminodiphenylsulfone (DDS), respectively. The investigation of cure kinetics was performed by differential scanning calorimetry using an isoconversional method. The high thermal stabilities of the cured samples were also studied by thermogravimetric analysis. In addition, no phase separation was observed for cured ECN/DDM and ECN/DDS blending with different amounts of TMBP by dynamic mechanical analysis and scanning electron microscopy. Moreover, the cured systems also exhibited excellent impact properties and low moisture absorption. All the results indicate that the ECN/TMBP/DDM and ECN/TMBP/DDS systems are promising materials in electronic packaging.

Original languageEnglish (US)
Pages (from-to)1556-1562
Number of pages7
JournalPolymer International
Volume60
Issue number10
DOIs
StatePublished - Oct 2011

All Science Journal Classification (ASJC) codes

  • Polymers and Plastics
  • Organic Chemistry
  • Materials Chemistry

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