Reaction kinetics, thermal properties of tetramethyl biphenyl epoxy resin cured with aromatic diamine

Tiezhu Fu, Gang Zhang, Shuangling Zhong, Chengji Zhao, Ke Shao, Lifeng Wang, Hui Na

Research output: Contribution to journalArticle

19 Scopus citations

Abstract

Epoxy resins, 4, 4′-diglycidyl (3, 3′, 5, 5′- tetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenol-A epoxy resin (DGEBA) cured with p-phenylenediamine (PDA) was performed by differential scanning calorimeter using an isoconversional method with dynamic conditions. The effect of the molar ratios of TMBP to PDA on the cure reaction kinetics was studied. The results showed that the curing of epoxy resins contains different stages. The activation energy was dependent of the degree of conversion. At the early of curing stages, the activation energy showed the activation energy took as maximum value. The effects of rigid rod groups and molar ratios of TMBP to PDA for the thermal properties were investigated by the DSC, DMA and TGA. The cured 2/1 TMBP/PDA system with rigid rod groups and high crosslink density had shown highest Tg and thermal degradation temperature.

Original languageEnglish (US)
Pages (from-to)2611-2620
Number of pages10
JournalJournal of Applied Polymer Science
Volume105
Issue number5
DOIs
StatePublished - Sep 5 2007

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Surfaces, Coatings and Films
  • Polymers and Plastics
  • Materials Chemistry

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