Reactive ion beam deposition of aluminum nitride thin films

S. Bhat; S. Ashok; S. J. Fonash; L. Tongson

doi:10.1007/BF02654015

Reactive ion beam deposition of aluminum nitride thin films

S. Bhat, S. Ashok, S. J. Fonash, L. Tongson

Research output: Contribution to journal › Article

7 Scopus citations

Abstract

Aluminum nitride thin films have been prepared at room temperature by reactive ion beam sputtering for potential use as a passivant and diffusion/anneal cap in compound semiconductor technology. The electrical and optical pro-perties of these films have been studied along with the in-fluence of thermal annealing on the material characteristics. The quality of the films has also been found to improve in the presence of atomic hydrogen during the deposition.

Original language	English (US)
Pages (from-to)	405-418
Number of pages	14
Journal	Journal of Electronic Materials
Volume	14
Issue number	4
DOIs	https://doi.org/10.1007/BF02654015
State	Published - Jul 1 1985

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All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Cite this

Bhat, S., Ashok, S., Fonash, S. J., & Tongson, L. (1985). Reactive ion beam deposition of aluminum nitride thin films. Journal of Electronic Materials, 14(4), 405-418. https://doi.org/10.1007/BF02654015

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Access to Document

10.1007/BF02654015