Real-time detection of surface cracks on silicon wafers during laser beam irradiation

Sungho Choi, Sung Hee Yoon, Kyung Young Jhang, Wan Soon Shin

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

In this paper, a real-time in situ method to detect surface crack initiation on silicon wafers during laser beam irradiation is proposed. This method collects scattered light from the silicon wafer surface subjected to the laser irradiation. When the crack is initiated, the laser beam is strongly scattered by the crack so that the proposed method can monitor the time of crack initiation based on the increases of the level of the scattering signal. In order to demonstrate the performance of this method, a silicon wafer specimen was illuminated by a continuous wave (CW) fiber laser beam (wavelength of 1,070 nm) and the scattered light was detected at three different laser powers. The scattering signal showed a very high level at the time of crack initiation. The detected crack initiation times were 11.6 s, 5.5 s, and 2.5 s at irradiances of 130 W/cm2, 149 W/cm2, and 168 W/cm2, respectively. These results agree well with the theoretical predictions. Based on these results, we demonstrated that the proposed method is very effective for the real-time in situ detection of surface cracking induced by laser beam irradiation on silicon wafers.

Original languageEnglish (US)
Pages (from-to)39-43
Number of pages5
JournalJournal of Mechanical Science and Technology
Volume29
Issue number1
DOIs
StatePublished - Jan 1 2015

Fingerprint

Silicon wafers
Crack initiation
Laser beams
Irradiation
Cracks
Scattering
Continuous wave lasers
Laser beam effects
Fiber lasers
Wavelength
Lasers

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Choi, Sungho ; Yoon, Sung Hee ; Jhang, Kyung Young ; Shin, Wan Soon. / Real-time detection of surface cracks on silicon wafers during laser beam irradiation. In: Journal of Mechanical Science and Technology. 2015 ; Vol. 29, No. 1. pp. 39-43.
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Real-time detection of surface cracks on silicon wafers during laser beam irradiation. / Choi, Sungho; Yoon, Sung Hee; Jhang, Kyung Young; Shin, Wan Soon.

In: Journal of Mechanical Science and Technology, Vol. 29, No. 1, 01.01.2015, p. 39-43.

Research output: Contribution to journalArticle

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