Restoration mechanisms in highly deformed Cu-based conductor wires

P. N. Kalu, D. R. Waryoba, S. Van Seiver, L. Brandao

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations

Abstract

Conductor wires used in pulsed magnets are traditionally fabricated by wire drawing. The strength of the conductors is influenced by the microstructure, which is partly dependent on the restoration mechanisms occurring during processing. This study provides an insight into the types of restoration mechanisms occurring during wire drawing of OFHC copper. The effects of the restoration mechanisms on the mechanical and electrical properties of the material were determined. Tensile test revealed the existence of steady state stress followed by strength softening at large processing strain. Optical and Orientation Imaging Microscopy (OIM) showed that the strength softening coincided with the onset of recrystallization in the material. Although restoration mechanisms of recovery and recrystallization played some role in the strengthening they had little or no effect on the resistivity of the material.

Original languageEnglish (US)
Pages (from-to)1296-1299
Number of pages4
JournalIEEE Transactions on Applied Superconductivity
Volume10
Issue number1
DOIs
StatePublished - Jan 1 2000
EventThe 16th International Conference on Magnet Tehnolopgy - Tallahassee, FL, USA
Duration: Sep 26 1999Oct 2 1999

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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