Restoration mechanisms in highly deformed Cu-based conductor wires

P. N. Kalu, D. R. Waryoba, S. Van Seiver, L. Brandao

Research output: Contribution to journalConference article

2 Citations (Scopus)

Abstract

Conductor wires used in pulsed magnets are traditionally fabricated by wire drawing. The strength of the conductors is influenced by the microstructure, which is partly dependent on the restoration mechanisms occurring during processing. This study provides an insight into the types of restoration mechanisms occurring during wire drawing of OFHC copper. The effects of the restoration mechanisms on the mechanical and electrical properties of the material were determined. Tensile test revealed the existence of steady state stress followed by strength softening at large processing strain. Optical and Orientation Imaging Microscopy (OIM) showed that the strength softening coincided with the onset of recrystallization in the material. Although restoration mechanisms of recovery and recrystallization played some role in the strengthening they had little or no effect on the resistivity of the material.

Original languageEnglish (US)
Pages (from-to)1296-1299
Number of pages4
JournalIEEE Transactions on Applied Superconductivity
Volume10
Issue number1
DOIs
StatePublished - Jan 1 2000
EventThe 16th International Conference on Magnet Tehnolopgy - Tallahassee, FL, USA
Duration: Sep 26 1999Oct 2 1999

Fingerprint

restoration
Restoration
conductors
wire
Wire
Wire drawing
softening
tensile tests
Processing
Magnets
Copper
Microscopic examination
Electric properties
magnets
recovery
electrical properties
mechanical properties
microscopy
Imaging techniques
Recovery

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Kalu, P. N. ; Waryoba, D. R. ; Van Seiver, S. ; Brandao, L. / Restoration mechanisms in highly deformed Cu-based conductor wires. In: IEEE Transactions on Applied Superconductivity. 2000 ; Vol. 10, No. 1. pp. 1296-1299.
@article{45f350b94c74427f812d2a5a83adbaae,
title = "Restoration mechanisms in highly deformed Cu-based conductor wires",
abstract = "Conductor wires used in pulsed magnets are traditionally fabricated by wire drawing. The strength of the conductors is influenced by the microstructure, which is partly dependent on the restoration mechanisms occurring during processing. This study provides an insight into the types of restoration mechanisms occurring during wire drawing of OFHC copper. The effects of the restoration mechanisms on the mechanical and electrical properties of the material were determined. Tensile test revealed the existence of steady state stress followed by strength softening at large processing strain. Optical and Orientation Imaging Microscopy (OIM) showed that the strength softening coincided with the onset of recrystallization in the material. Although restoration mechanisms of recovery and recrystallization played some role in the strengthening they had little or no effect on the resistivity of the material.",
author = "Kalu, {P. N.} and Waryoba, {D. R.} and {Van Seiver}, S. and L. Brandao",
year = "2000",
month = "1",
day = "1",
doi = "10.1109/77.828473",
language = "English (US)",
volume = "10",
pages = "1296--1299",
journal = "IEEE Transactions on Applied Superconductivity",
issn = "1051-8223",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "1",

}

Restoration mechanisms in highly deformed Cu-based conductor wires. / Kalu, P. N.; Waryoba, D. R.; Van Seiver, S.; Brandao, L.

In: IEEE Transactions on Applied Superconductivity, Vol. 10, No. 1, 01.01.2000, p. 1296-1299.

Research output: Contribution to journalConference article

TY - JOUR

T1 - Restoration mechanisms in highly deformed Cu-based conductor wires

AU - Kalu, P. N.

AU - Waryoba, D. R.

AU - Van Seiver, S.

AU - Brandao, L.

PY - 2000/1/1

Y1 - 2000/1/1

N2 - Conductor wires used in pulsed magnets are traditionally fabricated by wire drawing. The strength of the conductors is influenced by the microstructure, which is partly dependent on the restoration mechanisms occurring during processing. This study provides an insight into the types of restoration mechanisms occurring during wire drawing of OFHC copper. The effects of the restoration mechanisms on the mechanical and electrical properties of the material were determined. Tensile test revealed the existence of steady state stress followed by strength softening at large processing strain. Optical and Orientation Imaging Microscopy (OIM) showed that the strength softening coincided with the onset of recrystallization in the material. Although restoration mechanisms of recovery and recrystallization played some role in the strengthening they had little or no effect on the resistivity of the material.

AB - Conductor wires used in pulsed magnets are traditionally fabricated by wire drawing. The strength of the conductors is influenced by the microstructure, which is partly dependent on the restoration mechanisms occurring during processing. This study provides an insight into the types of restoration mechanisms occurring during wire drawing of OFHC copper. The effects of the restoration mechanisms on the mechanical and electrical properties of the material were determined. Tensile test revealed the existence of steady state stress followed by strength softening at large processing strain. Optical and Orientation Imaging Microscopy (OIM) showed that the strength softening coincided with the onset of recrystallization in the material. Although restoration mechanisms of recovery and recrystallization played some role in the strengthening they had little or no effect on the resistivity of the material.

UR - http://www.scopus.com/inward/record.url?scp=0033879995&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0033879995&partnerID=8YFLogxK

U2 - 10.1109/77.828473

DO - 10.1109/77.828473

M3 - Conference article

AN - SCOPUS:0033879995

VL - 10

SP - 1296

EP - 1299

JO - IEEE Transactions on Applied Superconductivity

JF - IEEE Transactions on Applied Superconductivity

SN - 1051-8223

IS - 1

ER -