Robust Class-I dielectric for high temperature applications

Xilin Xu, Jim Magee, Adriana Hoskins, Mark Laps, Abhijit Gurav, Gai Ying Yang, Clive A. Randall

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations


For MLCCs operating at temperatures of 150°C or above, such as in automotive electronics and power electronics, a robust dielectric material is necessary. In traditional X8R products (EIA specification, ΔC/C within ±15% between -55°C and +150°C compared that at 25°C), the dielectric material is designed for applications up to 150°C. However, at temperatures above 150°C, these typically suffer from degradation of reliability performance and severe reduction in capacitance, especially under DC bias conditions. Recently, a Ni-electrode based Class-I dielectric has been developed for high temperature application up to 200°C. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage while still maintaining good reliability. MLCCs made from this material can be qualified as X9G. This paper will report electrical properties and reliability test data on these Class-I type ceramic capacitors at temperatures ≥ 150°C. In addition, test data from D-E curves to energy density will be reported along with a discussion of possible mechanisms behind the robust reliability of this material.

Original languageEnglish (US)
Title of host publicationCARTS USA 2009
Number of pages13
StatePublished - Dec 1 2009
Event29th Symposium for passive electronics, CARTS-USA 2009 - Jacksonville, FL, United States
Duration: Mar 30 2009Apr 2 2009

Publication series

NameCARTS USA 2009


Other29th Symposium for passive electronics, CARTS-USA 2009
Country/TerritoryUnited States
CityJacksonville, FL

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality
  • Materials Science(all)


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