Semiconductor cleaning technology -past and future

Jerzy Ruzyllo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper first briefly reviews selected aspects of the evolution semiconductor cleaning technology underwent over the years then considers challenges it is facing as the new material systems and innovative complex device configurations are being explored by semiconductor industry. Emerging trends are identified and methods developed to assure adequate performance of wafer cleans are outlined. The technique using mixture of anhydrous HF (AHF) and alcoholic solvent is considered as an example of a process which can offer solution to various future challenges.

Original languageEnglish (US)
Title of host publicationECS Transactions - ISTC/CSTIC 2009 (CISTC)
Pages263-268
Number of pages6
Edition1 PART 1
DOIs
StatePublished - Dec 1 2009
EventISTC/CSTIC 2009 (CISTC) - Shanghai, China
Duration: Mar 19 2009Mar 20 2009

Publication series

NameECS Transactions
Number1 PART 1
Volume18
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

OtherISTC/CSTIC 2009 (CISTC)
CountryChina
CityShanghai
Period3/19/093/20/09

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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