Shallow hole drilling with ultrashort pulse lasers

B. R. Campbell, L. A. Forster, T. M. Lehecka, J. G. Thomas, V. V. Semak

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Using a picosecond laser system that can operate at 1064, 532, 355, and 266nm wavelengths, experiments were conducted with polished metal samples to study material removal from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of wavelength, energy and a double pulse exposure method were examined. Results were compared with simulations that model the material removal rates from ultrashort pulse drilling.

Original languageEnglish (US)
Title of host publicationPhoton Processing in Microelectronics and Photonics VII
DOIs
StatePublished - Jun 17 2008
EventPhoton Processing in Microelectronics and Photonics VII - San Jose, CA, United States
Duration: Jan 21 2008Jan 24 2008

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6879
ISSN (Print)0277-786X

Other

OtherPhoton Processing in Microelectronics and Photonics VII
CountryUnited States
CitySan Jose, CA
Period1/21/081/24/08

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Campbell, B. R., Forster, L. A., Lehecka, T. M., Thomas, J. G., & Semak, V. V. (2008). Shallow hole drilling with ultrashort pulse lasers. In Photon Processing in Microelectronics and Photonics VII [68790J] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 6879). https://doi.org/10.1117/12.760630