Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly

Andrew Carlson, Hyun Joon Kim-Lee, Jian Wu, Paulius Elvikis, Huanyu Cheng, Anton Kovalsky, Steven Elgan, Qingmin Yu, Placid M. Ferreira, Yonggang Huang, Kevin T. Turner, John A. Rogers

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Abstract

This letter describes the physics and application of an approach to transfer printing that utilizes targeted shear loading to modulate stamp adhesion in a controlled and repeatable fashion. Experimental measurements of pull-off forces as functions of shear and stamp dimension reveal key scaling properties and provide a means for comparison to theory and modeling. Examples of printed structures in suspended and multilayer configurations demonstrate some capabilities in micro/nanoscale materials assembly.

Original languageEnglish (US)
Article number264104
JournalApplied Physics Letters
Volume98
Issue number26
DOIs
StatePublished - Jun 27 2011

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All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

Cite this

Carlson, A., Kim-Lee, H. J., Wu, J., Elvikis, P., Cheng, H., Kovalsky, A., Elgan, S., Yu, Q., Ferreira, P. M., Huang, Y., Turner, K. T., & Rogers, J. A. (2011). Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly. Applied Physics Letters, 98(26), [264104]. https://doi.org/10.1063/1.3605558