ShieldUS: A novel design of dynamic shielding for eliminating 3D TSV crosstalk coupling noise

Yuan Ying Chang, Yoshi Shih Chieh Huang, Vijaykrishnan Narayanan, Chung Ta King

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Scopus citations

Abstract

3D IC is a promising technology to meet the demands of high throughput, high scalability, and low power consumption for future generation integrated circuits. One way to implement the 3D IC is to interconnect layers of two-dimensional (2D) IC with Through-Silicon Via (TSV), which shortens the signal lengths. Unfortunately, while TSVs are bundled together as a cluster, the crosstalk coupling noise may lead to transmission errors. As a result, the working frequency of TSVs has to be lowered to avoid the errors, leading to narrower bandwidth that TSVs can provide. In this paper, we first derive the crosstalk noise model from the perspective of 3D chip and then propose ShieldUS, a runtime data-to-TSVs remapping strategy. With ShieldUS, the transition patterns of data over TSVs are observed at runtime, and relatively stable bits will be mapped to the TSVs which act as shields to protect the other bits which have more fluctuations. We evaluate the performance of ShieldUS with address lines from real benchmark traces and data lines of different similarities. The results show that ShieldUS is accurate and flexible. We further study dynamic shielding and our design of Interval Equilibration Unit (IEU) can intelligently select suitable parameters for dynamic shielding, which makes dynamic shielding practical and does not need to predefine parameters. This also improves the practicability of ShieldUS.

Original languageEnglish (US)
Title of host publication2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
Pages675-680
Number of pages6
DOIs
StatePublished - May 20 2013
Event2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 - Yokohama, Japan
Duration: Jan 22 2013Jan 25 2013

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Other

Other2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
CountryJapan
CityYokohama
Period1/22/131/25/13

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering

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    Chang, Y. Y., Huang, Y. S. C., Narayanan, V., & King, C. T. (2013). ShieldUS: A novel design of dynamic shielding for eliminating 3D TSV crosstalk coupling noise. In 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 (pp. 675-680). [6509678] (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC). https://doi.org/10.1109/ASPDAC.2013.6509678