Sol Gel Processing of Low Permittivity, Fiber-Reinforced SiO2-Polyimide Substrates

S. C. Zhang, Gary Lynn Messing, W. Huebner

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Low permittivity ceramic substrates with a sandwich structure consisting of a porous, fiber-reinforced SiO2 core and two thin polymer plates were fabricated by sol-gel processing, and polymer infiltration. The rheological behavior of an aqueous colloidal SiO2 sol, containing short SiO2 fibers was studied as a function of particle loading, fiber loading and gelation time. Short SiO2 fibers were introduced to limit drying shrinkage and thus minimize substrate cracking during drying. After the psuedoplastic sol was tape cast and sintered at 1150°C for 2 h, a polyimide solution was infiltrated into the porous SiO2 core. Permittivities ranging from 1.81 to 3.08 could be obtained by using 32-42% SiO2, 5-50% polyimide and 63 to 8% porosity. The substrate strength was increased from 1.93 MPa to 3.83 MPa after polyimide infiltration.

Original languageEnglish (US)
Pages (from-to)91-100
Number of pages10
JournalJournal of Sol-Gel Science and Technology
Volume10
Issue number1
DOIs
StatePublished - Jan 1 1997

Fingerprint

polyimides
Polyimides
Sol-gels
Permittivity
gels
permittivity
fibers
Fibers
Polymethyl Methacrylate
Substrates
infiltration
Sols
Processing
Infiltration
drying
Drying
Polymers
Sandwich structures
sandwich structures
polymers

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Chemistry(all)
  • Biomaterials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

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title = "Sol Gel Processing of Low Permittivity, Fiber-Reinforced SiO2-Polyimide Substrates",
abstract = "Low permittivity ceramic substrates with a sandwich structure consisting of a porous, fiber-reinforced SiO2 core and two thin polymer plates were fabricated by sol-gel processing, and polymer infiltration. The rheological behavior of an aqueous colloidal SiO2 sol, containing short SiO2 fibers was studied as a function of particle loading, fiber loading and gelation time. Short SiO2 fibers were introduced to limit drying shrinkage and thus minimize substrate cracking during drying. After the psuedoplastic sol was tape cast and sintered at 1150°C for 2 h, a polyimide solution was infiltrated into the porous SiO2 core. Permittivities ranging from 1.81 to 3.08 could be obtained by using 32-42{\%} SiO2, 5-50{\%} polyimide and 63 to 8{\%} porosity. The substrate strength was increased from 1.93 MPa to 3.83 MPa after polyimide infiltration.",
author = "Zhang, {S. C.} and Messing, {Gary Lynn} and W. Huebner",
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Sol Gel Processing of Low Permittivity, Fiber-Reinforced SiO2-Polyimide Substrates. / Zhang, S. C.; Messing, Gary Lynn; Huebner, W.

In: Journal of Sol-Gel Science and Technology, Vol. 10, No. 1, 01.01.1997, p. 91-100.

Research output: Contribution to journalArticle

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