Stress and subsurface damage in polycrystalline SiC

J. A. Randi, W. J. Everson, A. Shorey, S. Shafrir, C. Miao, S. Jacobs

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Stress from material removal processes are compared by observation of the Twyman Effect. Stress scales with the abrasive size used during mechanical removal processes, and is reduced or eliminated by subsequent chemical removal processes. Subsurface damage for each surface has also been measured.

Original languageEnglish (US)
Title of host publicationOptical Fabrication and Testing, OFT 2008
PublisherOptical Society of America
ISBN (Print)9781557528612
StatePublished - Jan 1 2008
EventOptical Fabrication and Testing, OFT 2008 - Rochester, NY, United States
Duration: Oct 21 2008Oct 24 2008

Publication series

NameOptics InfoBase Conference Papers
ISSN (Electronic)2162-2701

Other

OtherOptical Fabrication and Testing, OFT 2008
CountryUnited States
CityRochester, NY
Period10/21/0810/24/08

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Atomic and Molecular Physics, and Optics

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