Suppression of acceptor deactivation in silicon by argon-ion implantation damage

S. Ashok, K. Srikanth

Research output: Contribution to journalArticle

6 Scopus citations

Abstract

Permeation of atomic hydrogen in Si damaged with Ar implantation has been studied. Ar was implanted at two distinct doses so as to straggle the amorphization threshold, and atomic hydrogen was subsequently introduced by low-energy ion implantation. The deactivation of dopant boron atoms by atomic hydrogen is drastically reduced in silicon wafers subjected to low-energy argon-ion implantation. Trapping of hydrogen in defect sites generated by argon implant and possibly the formation of molecular hydrogen in the implanted region hinders hydrogen permeation into the Si bulk.

Original languageEnglish (US)
Pages (from-to)1491-1494
Number of pages4
JournalJournal of Applied Physics
Volume66
Issue number3
DOIs
StatePublished - Dec 1 1989

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

Fingerprint Dive into the research topics of 'Suppression of acceptor deactivation in silicon by argon-ion implantation damage'. Together they form a unique fingerprint.

  • Cite this