Surface damage during remote plasma cleaning of silicon wafers

David C. Frystak, Jerzy Ruzyllo

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

Cleaning of silicon surfaces in chlorine based remote plasma can lead to roughening of the cleaned surface. In this paper, correlation between surface damage and various parameters of the remote plasma cleaning are determined. An ultrathin oxide grown prior to cleaning or addition of oxygen to the gaseous cleaning mixture are studied as a means to control surface damage.

Original languageEnglish (US)
Pages (from-to)129-140
Number of pages12
JournalProceedings - The Electrochemical Society
Volume90
Issue number9
StatePublished - 1990

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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