Tailoring the wettability of glass using a double-dielectric barrier discharge reactor

Quang Hung Trinh, Md Mokter Hossain, Seong H. Kim, Young Sun Mok

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

A double dielectric barrier discharge reactor operated at a low power frequency of 400 Hz and atmospheric pressure was utilized for regulating the wettability of glass surface. The hydrophobic treatment was performed by plasma polymerization of tetramethylsilane (TMS, in argon gas). The obtained results showed that the TMS coatings formed on the glass substrates without oxygen addition were smooth, uniform films with the maximum water contact angle (WCA) of about 106°, which were similar to those obtained by low pressure, high power frequency plasmas reported in the literature. The addition of oxygen into TMS/Ar plasma gas decreased the WCA and induced the formation of SiOSi and/or SiOC linkages, which dominated the existence of Si(CH2)nSi network formed in TMS/Ar (without oxygen) plasma.

Original languageEnglish (US)
Article numbere00522
JournalHeliyon
Volume4
Issue number1
DOIs
StatePublished - Jan 2018

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Wettability
Glass
Oxygen
Plasma Gases
Atmospheric Pressure
Water
Argon
Polymerization
Gases
Pressure

All Science Journal Classification (ASJC) codes

  • General

Cite this

Trinh, Quang Hung ; Hossain, Md Mokter ; Kim, Seong H. ; Mok, Young Sun. / Tailoring the wettability of glass using a double-dielectric barrier discharge reactor. In: Heliyon. 2018 ; Vol. 4, No. 1.
@article{6252b520a99241cdbb79dd3ee71c3482,
title = "Tailoring the wettability of glass using a double-dielectric barrier discharge reactor",
abstract = "A double dielectric barrier discharge reactor operated at a low power frequency of 400 Hz and atmospheric pressure was utilized for regulating the wettability of glass surface. The hydrophobic treatment was performed by plasma polymerization of tetramethylsilane (TMS, in argon gas). The obtained results showed that the TMS coatings formed on the glass substrates without oxygen addition were smooth, uniform films with the maximum water contact angle (WCA) of about 106°, which were similar to those obtained by low pressure, high power frequency plasmas reported in the literature. The addition of oxygen into TMS/Ar plasma gas decreased the WCA and induced the formation of SiOSi and/or SiOC linkages, which dominated the existence of Si(CH2)nSi network formed in TMS/Ar (without oxygen) plasma.",
author = "Trinh, {Quang Hung} and Hossain, {Md Mokter} and Kim, {Seong H.} and Mok, {Young Sun}",
year = "2018",
month = "1",
doi = "10.1016/j.heliyon.2018.e00522",
language = "English (US)",
volume = "4",
journal = "Heliyon",
issn = "2405-8440",
publisher = "Elsevier BV",
number = "1",

}

Tailoring the wettability of glass using a double-dielectric barrier discharge reactor. / Trinh, Quang Hung; Hossain, Md Mokter; Kim, Seong H.; Mok, Young Sun.

In: Heliyon, Vol. 4, No. 1, e00522, 01.2018.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Tailoring the wettability of glass using a double-dielectric barrier discharge reactor

AU - Trinh, Quang Hung

AU - Hossain, Md Mokter

AU - Kim, Seong H.

AU - Mok, Young Sun

PY - 2018/1

Y1 - 2018/1

N2 - A double dielectric barrier discharge reactor operated at a low power frequency of 400 Hz and atmospheric pressure was utilized for regulating the wettability of glass surface. The hydrophobic treatment was performed by plasma polymerization of tetramethylsilane (TMS, in argon gas). The obtained results showed that the TMS coatings formed on the glass substrates without oxygen addition were smooth, uniform films with the maximum water contact angle (WCA) of about 106°, which were similar to those obtained by low pressure, high power frequency plasmas reported in the literature. The addition of oxygen into TMS/Ar plasma gas decreased the WCA and induced the formation of SiOSi and/or SiOC linkages, which dominated the existence of Si(CH2)nSi network formed in TMS/Ar (without oxygen) plasma.

AB - A double dielectric barrier discharge reactor operated at a low power frequency of 400 Hz and atmospheric pressure was utilized for regulating the wettability of glass surface. The hydrophobic treatment was performed by plasma polymerization of tetramethylsilane (TMS, in argon gas). The obtained results showed that the TMS coatings formed on the glass substrates without oxygen addition were smooth, uniform films with the maximum water contact angle (WCA) of about 106°, which were similar to those obtained by low pressure, high power frequency plasmas reported in the literature. The addition of oxygen into TMS/Ar plasma gas decreased the WCA and induced the formation of SiOSi and/or SiOC linkages, which dominated the existence of Si(CH2)nSi network formed in TMS/Ar (without oxygen) plasma.

UR - http://www.scopus.com/inward/record.url?scp=85041622155&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85041622155&partnerID=8YFLogxK

U2 - 10.1016/j.heliyon.2018.e00522

DO - 10.1016/j.heliyon.2018.e00522

M3 - Article

C2 - 29560436

AN - SCOPUS:85041622155

VL - 4

JO - Heliyon

JF - Heliyon

SN - 2405-8440

IS - 1

M1 - e00522

ER -