Textural and microstructural inhomogeneities in drawn and annealed OFHC copper wire

Daudi R. Waryoba, Peter N. Kalu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

This work presents the results of a study on textural and microstructural inhomogeneities that develop during annealing of heavily drawn Oxygen free high conducting (OFHC) copper wire. The wire was drawn at room temperature to a true strain of 2.31 and isothermally annealed at 750°C for annealing times ranging from 10s to Ihr. The inhomogeneity of microstructure across the wire was clearly visible as three distinct concentric regions, which were classified as: the inner core, the mid section, and the outer surface. Two texture transitions were observed. At shorter annealing time, recrystallization which originated from the mid section, resulted into a strong〈100〉+weak〈111〉 duplex fiber texture. However, prolonged annealing gave rise to abnormal grain-growth that proceed from the mid section to the outer surfaces with a dominant 〈111〉 fiber component at the mid and inner region, and mixed components of 〈111〉, 〈100〉, and 〈112〉 at the outer surfaces.

Original languageEnglish (US)
Title of host publicationTextures of Materials, ICOTOM 14 - Proceedings of the 14th International Conference on Textures of Materials
Pages895-900
Number of pages6
Volume495-497
EditionPART 2
StatePublished - 2005
Event14th International Conference on Textures of Materials, ICOTOM 14 - Leuven, Belgium
Duration: Jul 11 2005Jul 15 2005

Publication series

NameMaterials Science Forum
NumberPART 2
Volume495-497
ISSN (Print)02555476

Other

Other14th International Conference on Textures of Materials, ICOTOM 14
CountryBelgium
CityLeuven
Period7/11/057/15/05

All Science Journal Classification (ASJC) codes

  • Materials Science(all)

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    Waryoba, D. R., & Kalu, P. N. (2005). Textural and microstructural inhomogeneities in drawn and annealed OFHC copper wire. In Textures of Materials, ICOTOM 14 - Proceedings of the 14th International Conference on Textures of Materials (PART 2 ed., Vol. 495-497, pp. 895-900). (Materials Science Forum; Vol. 495-497, No. PART 2).