The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy

Andre L. Wilson, Richard Martukanitz, Paul R. Howell

Research output: Contribution to journalArticle

Original languageEnglish (US)
Pages (from-to)1113-1118
Number of pages6
JournalMaterials Science Forum
Volume331-337 II
StatePublished - Dec 1 2000

Fingerprint

heat affected zone
solidus
Heat affected zone
welding
Phase equilibria
eutectics
aluminum alloys
Eutectics
Copper
Aluminum alloys
mathematical models
solutes
Welding
Grain boundaries
grain boundaries
Annealing
Mathematical models
copper
annealing
Temperature

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Wilson, Andre L. ; Martukanitz, Richard ; Howell, Paul R. / The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy. In: Materials Science Forum. 2000 ; Vol. 331-337 II. pp. 1113-1118.
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The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy. / Wilson, Andre L.; Martukanitz, Richard; Howell, Paul R.

In: Materials Science Forum, Vol. 331-337 II, 01.12.2000, p. 1113-1118.

Research output: Contribution to journalArticle

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