The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy

Andre L. Wilson, Richard P. Martukanitz, Paul R. Howell

Research output: Contribution to journal › Article › peer-review

Original language	English (US)
Pages (from-to)	1113-1118
Number of pages	6
Journal	Materials Science Forum
Volume	331-337 II
DOIs	https://doi.org/10.4028/www.scientific.net/msf.331-337.1113
State	Published - 2000

All Science Journal Classification (ASJC) codes

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title = "The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy",

author = "Wilson, {Andre L.} and Martukanitz, {Richard P.} and Howell, {Paul R.}",

year = "2000",

doi = "10.4028/www.scientific.net/msf.331-337.1113",

language = "English (US)",

volume = "331-337 II",

pages = "1113--1118",

journal = "Materials Science Forum",

issn = "0255-5476",

publisher = "Trans Tech Publications",

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TY - JOUR

T1 - The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy

AU - Wilson, Andre L.

AU - Martukanitz, Richard P.

AU - Howell, Paul R.

PY - 2000

Y1 - 2000

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AN - SCOPUS:17544367056

VL - 331-337 II

SP - 1113

EP - 1118

JO - Materials Science Forum

JF - Materials Science Forum

SN - 0255-5476

ER -