The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy

Andre L. Wilson, Richard P. Martukanitz, Paul R. Howell

Research output: Contribution to journalArticle

Original languageEnglish (US)
Pages (from-to)1113-1118
Number of pages6
JournalMaterials Science Forum
Volume331-337 II
StatePublished - Dec 1 2000

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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