| Original language | English (US) |
|---|---|
| Pages (from-to) | 1113-1118 |
| Number of pages | 6 |
| Journal | Materials Science Forum |
| Volume | 331-337 II |
| State | Published - Dec 1 2000 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
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The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy. / Wilson, Andre L.; Martukanitz, Richard; Howell, Paul R.
In: Materials Science Forum, Vol. 331-337 II, 01.12.2000, p. 1113-1118.Research output: Contribution to journal › Article
TY - JOUR
T1 - The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy
AU - Wilson, Andre L.
AU - Martukanitz, Richard
AU - Howell, Paul R.
PY - 2000/12/1
Y1 - 2000/12/1
UR - http://www.scopus.com/inward/record.url?scp=17544367056&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=17544367056&partnerID=8YFLogxK
M3 - Article
AN - SCOPUS:17544367056
VL - 331-337 II
SP - 1113
EP - 1118
JO - Materials Science Forum
JF - Materials Science Forum
SN - 0255-5476
ER -