The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy

Andre L. Wilson, Richard P. Martukanitz, Paul R. Howell

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All Science Journal Classification (ASJC) codes

@article{1a7c6e83b6894fbdb3191ad19e193d8d,

title = "The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy",

author = "Wilson, {Andre L.} and Martukanitz, {Richard P.} and Howell, {Paul R.}",

year = "2000",

month = dec,

day = "1",

language = "English (US)",

volume = "331-337 II",

pages = "1113--1118",

journal = "Materials Science Forum",

issn = "0255-5476",

publisher = "Trans Tech Publications",

}

TY - JOUR

T1 - The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy

AU - Wilson, Andre L.

AU - Martukanitz, Richard P.

AU - Howell, Paul R.

PY - 2000/12/1

Y1 - 2000/12/1

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M3 - Article

AN - SCOPUS:17544367056

VL - 331-337 II

SP - 1113

EP - 1118

JO - Materials Science Forum

JF - Materials Science Forum

SN - 0255-5476

ER -