The effect of substrate temperature on the solidification of tin bonding wire via droplets jetting forming

Dan Su, Chunxi Wang, Sheng Liu, Xiaotian Li, Honghai Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The well-controlled droplets jetting forming permits high efficiency in bonding wire manufacture. In order to achieve better control of the droplets jetting forming, numerous parameters in the jetting process should be studied. This article study the effect of substrate temperature on the solidification of tin bonding wire. Experiments on the solidification of tin bonding wire under different substrate temperature have been conducted. Image of the bonding wire's surface have been captured using a CCD and a microscope. And the effect of substrate temperature on the solidification of tin bonding wire are discussed.

Original languageEnglish (US)
Title of host publication2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016
EditorsKeyun Bi, Sheng Liu, Shengjun Zhou
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1503-1507
Number of pages5
ISBN (Electronic)9781509013968
DOIs
StatePublished - Oct 4 2016
Event17th International Conference on Electronic Packaging Technology, ICEPT 2016 - Wuhan, China
Duration: Aug 16 2016Aug 19 2016

Publication series

Name2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016

Conference

Conference17th International Conference on Electronic Packaging Technology, ICEPT 2016
CountryChina
CityWuhan
Period8/16/168/19/16

Fingerprint

Tin
Solidification
Wire
Substrates
Temperature
Charge coupled devices
Microscopes
Experiments

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanics of Materials

Cite this

Su, D., Wang, C., Liu, S., Li, X., & Zhang, H. (2016). The effect of substrate temperature on the solidification of tin bonding wire via droplets jetting forming. In K. Bi, S. Liu, & S. Zhou (Eds.), 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016 (pp. 1503-1507). [7583408] (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT.2016.7583408
Su, Dan ; Wang, Chunxi ; Liu, Sheng ; Li, Xiaotian ; Zhang, Honghai. / The effect of substrate temperature on the solidification of tin bonding wire via droplets jetting forming. 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. editor / Keyun Bi ; Sheng Liu ; Shengjun Zhou. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 1503-1507 (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016).
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abstract = "The well-controlled droplets jetting forming permits high efficiency in bonding wire manufacture. In order to achieve better control of the droplets jetting forming, numerous parameters in the jetting process should be studied. This article study the effect of substrate temperature on the solidification of tin bonding wire. Experiments on the solidification of tin bonding wire under different substrate temperature have been conducted. Image of the bonding wire's surface have been captured using a CCD and a microscope. And the effect of substrate temperature on the solidification of tin bonding wire are discussed.",
author = "Dan Su and Chunxi Wang and Sheng Liu and Xiaotian Li and Honghai Zhang",
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language = "English (US)",
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publisher = "Institute of Electrical and Electronics Engineers Inc.",
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Su, D, Wang, C, Liu, S, Li, X & Zhang, H 2016, The effect of substrate temperature on the solidification of tin bonding wire via droplets jetting forming. in K Bi, S Liu & S Zhou (eds), 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016., 7583408, 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Institute of Electrical and Electronics Engineers Inc., pp. 1503-1507, 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 8/16/16. https://doi.org/10.1109/ICEPT.2016.7583408

The effect of substrate temperature on the solidification of tin bonding wire via droplets jetting forming. / Su, Dan; Wang, Chunxi; Liu, Sheng; Li, Xiaotian; Zhang, Honghai.

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. ed. / Keyun Bi; Sheng Liu; Shengjun Zhou. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1503-1507 7583408 (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - The well-controlled droplets jetting forming permits high efficiency in bonding wire manufacture. In order to achieve better control of the droplets jetting forming, numerous parameters in the jetting process should be studied. This article study the effect of substrate temperature on the solidification of tin bonding wire. Experiments on the solidification of tin bonding wire under different substrate temperature have been conducted. Image of the bonding wire's surface have been captured using a CCD and a microscope. And the effect of substrate temperature on the solidification of tin bonding wire are discussed.

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Su D, Wang C, Liu S, Li X, Zhang H. The effect of substrate temperature on the solidification of tin bonding wire via droplets jetting forming. In Bi K, Liu S, Zhou S, editors, 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 1503-1507. 7583408. (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016). https://doi.org/10.1109/ICEPT.2016.7583408