The effects of substrates on the characteristics of polycrystalline silicon thin film transistors

Y. Z. Wang, Osama O. Awadelkarim, J. G. Couillard, D. G. Ast

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

We report on the impact of substrates on n-channel and p-channel polycrystalline-silicon (poly-Si) thin film transistors (TFTs) performance and hot carrier stress (HCS) reliability. Corning Code 1737 glass, fused silica and oxidized Si were used as substrates on which 1000 Å of base poly-Si films were deposited by low-pressure chemical vapor deposition at 620°C. Top-gated TFTs of nominal channel lengths ∼15 μm were fabricated on these films and tested before and after the application of HCS. It is found out that both n- and p-TFTs on fused silica substrates perform better than their counterparts on bare 1737 glass and oxidized Si substrates. Also n- and p-TFTs on fused silica, unlike those on 1737 glass and oxidized silicon substrates, are observed to be more resistant to HCS. The implications are that the substrate influences the characteristics and the HCS reliability of TFTs via grain geometries and impurity in poly-Si which are controlled by poly-Si/substrate interface properties as well as the substrate's impurity content. Variations in TFTs leakage current, threshold voltage, and subthreshold swing with substrate type and with HCS are interpreted in terms of a model incorporating generation/population of traps in the poly-Si channel, bulk gate-oxide, or poly-Si/oxide interface coupled with field-assisted emission of carriers from these traps.

Original languageEnglish (US)
Pages (from-to)1689-1696
Number of pages8
JournalSolid-State Electronics
Volume42
Issue number9
DOIs
StatePublished - Sep 1 1998

Fingerprint

Thin film transistors
Polysilicon
transistors
Hot carriers
silicon
Substrates
thin films
Fused silica
Glass
traps
Impurities
silicon dioxide
Low pressure chemical vapor deposition
impurities
glass
Silicon oxides
silica glass
Silicon
silicon films
silicon oxides

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

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abstract = "We report on the impact of substrates on n-channel and p-channel polycrystalline-silicon (poly-Si) thin film transistors (TFTs) performance and hot carrier stress (HCS) reliability. Corning Code 1737 glass, fused silica and oxidized Si were used as substrates on which 1000 {\AA} of base poly-Si films were deposited by low-pressure chemical vapor deposition at 620°C. Top-gated TFTs of nominal channel lengths ∼15 μm were fabricated on these films and tested before and after the application of HCS. It is found out that both n- and p-TFTs on fused silica substrates perform better than their counterparts on bare 1737 glass and oxidized Si substrates. Also n- and p-TFTs on fused silica, unlike those on 1737 glass and oxidized silicon substrates, are observed to be more resistant to HCS. The implications are that the substrate influences the characteristics and the HCS reliability of TFTs via grain geometries and impurity in poly-Si which are controlled by poly-Si/substrate interface properties as well as the substrate's impurity content. Variations in TFTs leakage current, threshold voltage, and subthreshold swing with substrate type and with HCS are interpreted in terms of a model incorporating generation/population of traps in the poly-Si channel, bulk gate-oxide, or poly-Si/oxide interface coupled with field-assisted emission of carriers from these traps.",
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The effects of substrates on the characteristics of polycrystalline silicon thin film transistors. / Wang, Y. Z.; Awadelkarim, Osama O.; Couillard, J. G.; Ast, D. G.

In: Solid-State Electronics, Vol. 42, No. 9, 01.09.1998, p. 1689-1696.

Research output: Contribution to journalArticle

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