The high temperature creep deformation of Si3N4-6Y2O3-2Al2O3

J. A. Todd, Zhi Yue Xu

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Abstract

The creep properties of silicon nitride containing 6 wt % yttria and 2 wt% alumina have been determined in the temperature range 1573 to 1673 K. The stress exponent, n, in the equation {Mathematical expression} ∝ σn was determined to be 2.00±0.15 and the true activation energy was found to be 692±25 kJ mol-1. Transmission electron microscopy studies showed that deformation occurred in the grain boundary glassy phase accompanied by microcrack formation and cavitation. The steady state creep results are consistent with a diffusion controlled creep mechanism involving nitrogen diffusion through the grain boundary glassy phase.

Original languageEnglish (US)
Pages (from-to)4443-4452
Number of pages10
JournalJournal of Materials Science
Volume24
Issue number12
DOIs
StatePublished - Dec 1 1989

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All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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