The I-C-D-M methodology

Improving undergraduate engineering student motivation, satisfaction, and performance

Paul Carl Lynch, Shraddha C. Sangelkar, Gina Demeo, Beshoy Morkos

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper combines two bodies of engineering education work aimed at improving the undergraduate engineering classroom experience for industrial and mechanical engineering students. The integration of these two bodies of work has led researchers to propose a framework for maximizing undergraduate engineering student motivation, satisfaction, and performance. The "Interact, Cultivate, Deliver" or I-C-D methodology has been shown to significantly increase undergraduate industrial engineering student ratings of teaching effectiveness when compared to industrial engineering courses where the I-C-D methodology is not formally implemented. Decreasing student anxiety while improving student self-recognition, cognitive value, and intrinsic value have been shown to be the driving factors behind student motivation among undergraduate mechanical engineering students. Along with discussing the results of both studies, an optimal teaching methodology dubbed "Interact, Cultivate, Deliver, Motivate" or I-C-D-M methodology is proposed to maximize student motivation and satisfaction leading to increased engineering student retention and performance.

Original languageEnglish (US)
Title of host publicationFIE 2017 - Frontiers in Education, Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-7
Number of pages7
Volume2017-October
ISBN (Electronic)9781509059195
DOIs
StatePublished - Dec 12 2017
Event47th IEEE Frontiers in Education Conference, FIE 2017 - Indianapolis, United States
Duration: Oct 18 2017Oct 21 2017

Other

Other47th IEEE Frontiers in Education Conference, FIE 2017
CountryUnited States
CityIndianapolis
Period10/18/1710/21/17

Fingerprint

Students
engineering
methodology
performance
Industrial engineering
student
mechanical engineering
Mechanical engineering
Teaching
effectiveness of teaching
Engineering education
rating
anxiety
classroom
Values
education
experience

All Science Journal Classification (ASJC) codes

  • Software
  • Education
  • Computer Science Applications

Cite this

Lynch, P. C., Sangelkar, S. C., Demeo, G., & Morkos, B. (2017). The I-C-D-M methodology: Improving undergraduate engineering student motivation, satisfaction, and performance. In FIE 2017 - Frontiers in Education, Conference Proceedings (Vol. 2017-October, pp. 1-7). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/FIE.2017.8190693
Lynch, Paul Carl ; Sangelkar, Shraddha C. ; Demeo, Gina ; Morkos, Beshoy. / The I-C-D-M methodology : Improving undergraduate engineering student motivation, satisfaction, and performance. FIE 2017 - Frontiers in Education, Conference Proceedings. Vol. 2017-October Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1-7
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Lynch, PC, Sangelkar, SC, Demeo, G & Morkos, B 2017, The I-C-D-M methodology: Improving undergraduate engineering student motivation, satisfaction, and performance. in FIE 2017 - Frontiers in Education, Conference Proceedings. vol. 2017-October, Institute of Electrical and Electronics Engineers Inc., pp. 1-7, 47th IEEE Frontiers in Education Conference, FIE 2017, Indianapolis, United States, 10/18/17. https://doi.org/10.1109/FIE.2017.8190693

The I-C-D-M methodology : Improving undergraduate engineering student motivation, satisfaction, and performance. / Lynch, Paul Carl; Sangelkar, Shraddha C.; Demeo, Gina; Morkos, Beshoy.

FIE 2017 - Frontiers in Education, Conference Proceedings. Vol. 2017-October Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-7.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Lynch PC, Sangelkar SC, Demeo G, Morkos B. The I-C-D-M methodology: Improving undergraduate engineering student motivation, satisfaction, and performance. In FIE 2017 - Frontiers in Education, Conference Proceedings. Vol. 2017-October. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1-7 https://doi.org/10.1109/FIE.2017.8190693