The interfacial failure sequence during fiber pushout in metal matrix composites

J. M. Galbraith, E. P. Rhyne, D. A. Koss, J. R. Hellmann

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

Laser profilometry measurements of fiber displacements during thin-slice fiber pushout tests of three MMC systems indicate that interfacial failure initiates at the specimen backface, opposite the indenter location. Backface failure initiation occurs at loads as low as 50% of the maximum "debond" load, even under test conditions designed to minimize specimen flexure under load. Finally, at least in the two sapphire-TiAl systems examined, there is evidence that the entire fiber displaces as a unit under increasing loads prior to the maximum debond load. The above failure sequence is consistent with recent analyses (9,15) which predict backface failure initiation in thin-slice MMC specimens in which large thermally induced residual stresses exist. The present data also suggest a difficulty in associating the maximum debond load, PMAX, solely with crack growth.

Original languageEnglish (US)
Pages (from-to)543-549
Number of pages7
JournalScripta Materialia
Volume35
Issue number4
DOIs
StatePublished - Aug 15 1996

Fingerprint

fiber pushout
metal matrix composites
Metals
Fibers
Composite materials
Profilometry
Aluminum Oxide
Sapphire
Crack propagation
Residual stresses
fibers
Lasers
flexing
residual stress
sapphire
cracks

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Galbraith, J. M. ; Rhyne, E. P. ; Koss, D. A. ; Hellmann, J. R. / The interfacial failure sequence during fiber pushout in metal matrix composites. In: Scripta Materialia. 1996 ; Vol. 35, No. 4. pp. 543-549.
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The interfacial failure sequence during fiber pushout in metal matrix composites. / Galbraith, J. M.; Rhyne, E. P.; Koss, D. A.; Hellmann, J. R.

In: Scripta Materialia, Vol. 35, No. 4, 15.08.1996, p. 543-549.

Research output: Contribution to journalArticle

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AB - Laser profilometry measurements of fiber displacements during thin-slice fiber pushout tests of three MMC systems indicate that interfacial failure initiates at the specimen backface, opposite the indenter location. Backface failure initiation occurs at loads as low as 50% of the maximum "debond" load, even under test conditions designed to minimize specimen flexure under load. Finally, at least in the two sapphire-TiAl systems examined, there is evidence that the entire fiber displaces as a unit under increasing loads prior to the maximum debond load. The above failure sequence is consistent with recent analyses (9,15) which predict backface failure initiation in thin-slice MMC specimens in which large thermally induced residual stresses exist. The present data also suggest a difficulty in associating the maximum debond load, PMAX, solely with crack growth.

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