The role of crystallographic orientation on the forces generated in ultra-precision grinding of anisotropic materials such as monocrystalline silicon

Eric Russell Marsh, Jeremiah A. Couey, R. Ryan Vallance, Allen Y. Yi

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Monitoring forces when grinding crystalline materials is advantageous for optimising process conditions, improving process control and producing high quality parts. Yet, this is challenging in precision applications where aerostatic spindles and small depths of cut are common. This work presents a system of measuring grinding forces in precision applications. Several experiments demonstrate the performance in monitoring diamond wheel dressing, detecting workpiece contact and process monitoring. The system appears promise for monitoring precision wafer.

Original languageEnglish (US)
Pages (from-to)270-283
Number of pages14
JournalInternational Journal of Manufacturing Technology and Management
Volume12
Issue number1-3
StatePublished - 2007

Fingerprint

Monocrystalline silicon
Monitoring
Wheel dressing
Process monitoring
Process control
Diamonds
Crystalline materials
Grinding
Experiments

All Science Journal Classification (ASJC) codes

  • Business, Management and Accounting(all)

Cite this

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