The role of crystallographic orientation on the forces generated in ultra-precision grinding of anisotropic materials such as monocrystalline silicon

Eric R. Marsh, Jeremiah A. Couey, R. Ryan Vallance, Allen Y. Yi

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

Monitoring forces when grinding crystalline materials is advantageous for optimising process conditions, improving process control and producing high quality parts. Yet, this is challenging in precision applications where aerostatic spindles and small depths of cut are common. This work presents a system of measuring grinding forces in precision applications. Several experiments demonstrate the performance in monitoring diamond wheel dressing, detecting workpiece contact and process monitoring. The system appears promise for monitoring precision wafer.

Original languageEnglish (US)
Pages (from-to)270-283
Number of pages14
JournalInternational Journal of Manufacturing Technology and Management
Volume12
Issue number1-3
DOIs
StatePublished - 2007

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Strategy and Management
  • Industrial and Manufacturing Engineering
  • Information Systems and Management
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'The role of crystallographic orientation on the forces generated in ultra-precision grinding of anisotropic materials such as monocrystalline silicon'. Together they form a unique fingerprint.

Cite this