Transient temperatures are measured on a mask membrane in an etching environment after turning off the plasma to determine various heat transfer characteristics of the mask. These characteristics include the incident heat flux, effective membrane emissivity, and heat transfer coefficient for a selected helium flow condition. These temperatures are compared to analytical and finite element calculations. Good agreement is found between calculated and measured temperature decays. Using these characteristics in the finite element models, the steady-state temperature distribution in the mask is computed for both the no helium and flowing helium cases. Again, good agreement between calculated and measured temperatures is found for both cases. Based on these results, minimal temperature rise and subsequently minimal gradients occur for the flowing helium case. These techniques can be used to optimize the membrane cooling process and predict a usable membrane area.
|Original language||English (US)|
|Number of pages||5|
|Journal||Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures|
|State||Published - Nov 1995|
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering