Thermal-aware 3D IC designs

Xiaoxia Wu, Yuan Xie, Vijaykirshnan Narayanan

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Scopus citations

Abstract

Power and thermal issues have become the primary concerns in traditional 2D IC design. Although emerging 3D technology offers several benefits over 2D, the stacking of multiple active layers in 3D design leads to higher power densities than its 2D counterpart, exacerbating the thermal issue. Therefore, it is essential to conduct thermal-aware 3D IC designs. This chapter presents an overview of thermal modeling for 3D IC and outlines solution schemes to overcome the thermal challenges at Electrical Design Automation (EDA) and architectural levels.

Original languageEnglish (US)
Title of host publication3D Integration for VLSI Systems
PublisherPan Stanford Publishing Pte. Ltd.
Pages313-334
Number of pages22
ISBN (Print)9789814303811
DOIs
StatePublished - Sep 30 2011

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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    Wu, X., Xie, Y., & Narayanan, V. (2011). Thermal-aware 3D IC designs. In 3D Integration for VLSI Systems (pp. 313-334). Pan Stanford Publishing Pte. Ltd.. https://doi.org/10.4032/9789814303828