Thermal-aware design considerations for application-specific instruction set processor

Hai Lin, Guangyu Sun, Yunsi Fei, Yuan Xie, Anand Sivasubramaniam

Research output: Contribution to conferencePaper

2 Scopus citations

Abstract

Application-specific instruction set processor (ASIP) has been considered as a good candidate for embedded system design in the past decade. Major research effort has been devoted to customized configuration and instruction set extension for performance improvement with the area constraint. Recent research has taken power consumption and energy efficiency as the second metric, which is critical for embedded and portable devices. However, as the technology scales, power density increases and hence thermal issue has emerged as another critical concern in nanometer circuit designs. In this paper, we factor in the thermal consideration during ASIP synthesis process, and explore the relationship and trade-offs among three dimensions: performance, energy, and temperature. Both the theoretical analysis and the real design implementations of several example custom processors have demonstrated the importance of thermal-aware ASIP synthesis. To the best of our knowledge, this is the first thermal-aware design methodology for ASIPs.

Original languageEnglish (US)
Pages63-68
Number of pages6
DOIs
StatePublished - Sep 29 2008
Event2008 Symposium on Application Specific Processors, SASP 2008 - Anaheim, CA, United States
Duration: Jun 8 2008Jun 9 2008

Other

Other2008 Symposium on Application Specific Processors, SASP 2008
CountryUnited States
CityAnaheim, CA
Period6/8/086/9/08

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All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Lin, H., Sun, G., Fei, Y., Xie, Y., & Sivasubramaniam, A. (2008). Thermal-aware design considerations for application-specific instruction set processor. 63-68. Paper presented at 2008 Symposium on Application Specific Processors, SASP 2008, Anaheim, CA, United States. https://doi.org/10.1109/SASP.2008.4570787