TY - GEN
T1 - Thermal-aware floorplanning using genetic algorithms
AU - Hung, W. L.
AU - Xie, Y.
AU - Narayanan, Vijaykrishnan
AU - Addo-Quaye, C.
AU - Theocharides, T.
AU - Irwin, Mary Jane
PY - 2005/12/1
Y1 - 2005/12/1
N2 - In this work, we present a genetic algorithm based thermal-aware floorplanning framework that aims at reducing hot spots and distributing temperature evenly across a chip while optimizing the traditional design metric, chip area. The floorplanning problem is formulated as a genetic algorithm problem, and a tool called HotSpot is used to calculate floorplanning temperature based on the power dissipation, the physical dimension, and the location of modules. Area and/or temperature optimizations guide the genetic algorithm to generate the final fittest solution. The experimental results using MCNC benchmarks and a face detection chip show that our combined area and thermal optimization technique decreases the peak temperature sufficiently while providing floorplans that are as compact as the traditional area-oriented techniques.
AB - In this work, we present a genetic algorithm based thermal-aware floorplanning framework that aims at reducing hot spots and distributing temperature evenly across a chip while optimizing the traditional design metric, chip area. The floorplanning problem is formulated as a genetic algorithm problem, and a tool called HotSpot is used to calculate floorplanning temperature based on the power dissipation, the physical dimension, and the location of modules. Area and/or temperature optimizations guide the genetic algorithm to generate the final fittest solution. The experimental results using MCNC benchmarks and a face detection chip show that our combined area and thermal optimization technique decreases the peak temperature sufficiently while providing floorplans that are as compact as the traditional area-oriented techniques.
UR - http://www.scopus.com/inward/record.url?scp=84886688297&partnerID=8YFLogxK
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U2 - 10.1109/ISQED.2005.122
DO - 10.1109/ISQED.2005.122
M3 - Conference contribution
AN - SCOPUS:84886688297
SN - 0769523013
SN - 9780769523019
T3 - Proceedings - International Symposium on Quality Electronic Design, ISQED
SP - 634
EP - 639
BT - Proceedings - 6th International Symposium on Quality Electronic Design, ISQED 2005
T2 - 6th International Symposium on Quality Electronic Design, ISQED 2005
Y2 - 21 March 2005 through 23 March 2005
ER -