Thermal-aware reliability analysis for platform FPGAs

Prasanth Mangalagiri, Sungmin Bae, Ramakrishnan Krishnan, Yuan Xie, Vijaykrishnan Narayanan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

21 Citations (Scopus)

Abstract

Increasing levels of integration in Field Programmable Gate Arrays, have resulted in high on-chip power densities, and temperatures. The heterogeneity of components and scaled feature sizes in Platform FPGAs have made them vulnerable to various temperature dependent failure mechanisms. Hence, we need to introduce temperature awareness in tackling such failures that affect the lifetime reliability of FPGAs. In this paper, we present a Dynamic Thermal-aware Reliability Management (DTRM) framework to analyze the impact of temperature variations on the longterm/lifetime reliability of Platform FPGAs. We first study the temperature variations, both across and with-in designs, due to the use of various hard-blocks within a 65nm Platform FPGA. In the presence of such variations, we demonstrate the vulnerability of Platform FPGAs to two different hard-failures, namely, Electromigration, and Time Dependent Dielectric Breakdown (TDDB). We also analyze the performance degradation caused by Negative Bias Temperature Instability (NBTI) in the presence of thermal-variations. We validate the temperature variations estimated by the DTRM framework using a ring oscillator based real-time temperature measurement technique.

Original languageEnglish (US)
Title of host publication2008 IEEE/ACM International Conference on Computer-Aided Design Digest of Technical Papers, ICCAD 2008
Pages722-727
Number of pages6
DOIs
StatePublished - Dec 26 2008
Event2008 International Conference on Computer-Aided Design, ICCAD - San Jose, CA, United States
Duration: Nov 10 2008Nov 13 2008

Publication series

NameIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN (Print)1092-3152

Other

Other2008 International Conference on Computer-Aided Design, ICCAD
CountryUnited States
CitySan Jose, CA
Period11/10/0811/13/08

Fingerprint

Reliability analysis
Field programmable gate arrays (FPGA)
Temperature
Electromigration
Time measurement
Electric breakdown
Temperature measurement
Hot Temperature
Degradation

All Science Journal Classification (ASJC) codes

  • Software
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

Cite this

Mangalagiri, P., Bae, S., Krishnan, R., Xie, Y., & Narayanan, V. (2008). Thermal-aware reliability analysis for platform FPGAs. In 2008 IEEE/ACM International Conference on Computer-Aided Design Digest of Technical Papers, ICCAD 2008 (pp. 722-727). [4681656] (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD). https://doi.org/10.1109/ICCAD.2008.4681656
Mangalagiri, Prasanth ; Bae, Sungmin ; Krishnan, Ramakrishnan ; Xie, Yuan ; Narayanan, Vijaykrishnan. / Thermal-aware reliability analysis for platform FPGAs. 2008 IEEE/ACM International Conference on Computer-Aided Design Digest of Technical Papers, ICCAD 2008. 2008. pp. 722-727 (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).
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Mangalagiri, P, Bae, S, Krishnan, R, Xie, Y & Narayanan, V 2008, Thermal-aware reliability analysis for platform FPGAs. in 2008 IEEE/ACM International Conference on Computer-Aided Design Digest of Technical Papers, ICCAD 2008., 4681656, IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD, pp. 722-727, 2008 International Conference on Computer-Aided Design, ICCAD, San Jose, CA, United States, 11/10/08. https://doi.org/10.1109/ICCAD.2008.4681656

Thermal-aware reliability analysis for platform FPGAs. / Mangalagiri, Prasanth; Bae, Sungmin; Krishnan, Ramakrishnan; Xie, Yuan; Narayanan, Vijaykrishnan.

2008 IEEE/ACM International Conference on Computer-Aided Design Digest of Technical Papers, ICCAD 2008. 2008. p. 722-727 4681656 (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Mangalagiri P, Bae S, Krishnan R, Xie Y, Narayanan V. Thermal-aware reliability analysis for platform FPGAs. In 2008 IEEE/ACM International Conference on Computer-Aided Design Digest of Technical Papers, ICCAD 2008. 2008. p. 722-727. 4681656. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD). https://doi.org/10.1109/ICCAD.2008.4681656