Thermal characterization of GaN vertical p-i-n diodes

J. Dallas, G. Pavlidis, B. Chatterjee, J. S. Lundh, M. Ji, J. Kim, T. Kao, T. Detchprohm, R. D. Dupuis, S. Shen, S. Graham, Sukwon Choi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

In this study, pioneering research was performed on GaN p-i-n diodes for the first ever assessment of surface temperature distribution by incorporating the use of infrared (IR) thermography, thermoreflectance thermal imaging, Raman thermometry, and thermal simulations. Each technique was advanced in order to obtain self-consistent results with higher accuracy. A two-temperature emissivity calibration procedure was utilized for IR measurements to acquire a temperature map of the p-contact metallization. Higher spatial resolution thermoreflectance thermal imaging was performed with a diverse range of illumination wavelengths including 470 nm and 530 nm. To confirm the results of thermoreflectance, TiO2 thermal nanoprobes were deposited on the device surface which enabled Raman thermometry to be performed on the p-contact metallization. Coherence of the techniques was then validated through thermal modeling. The results suggest that IR thermography, when using the two-temperature emissivity correction procedure, gives reasonable results at high power dissipating conditions. Thermoreflectance and nanopowder assisted Raman thermometry are viable options for GaN vertical device temperature assessment. However, results from Raman thermometry possess relatively large uncertainties and thermoreflectance measurements require multiple illumination wavelengths to ensure the validity of the measured temperatures that are derived from the thermoreflectance calibration coefficient.

Original languageEnglish (US)
Title of host publicationProceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages328-333
Number of pages6
ISBN (Electronic)9781509029945
DOIs
StatePublished - Jul 25 2017
Event16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 - Orlando, United States
Duration: May 30 2017Jun 2 2017

Other

Other16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
CountryUnited States
CityOrlando
Period5/30/176/2/17

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering

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    Dallas, J., Pavlidis, G., Chatterjee, B., Lundh, J. S., Ji, M., Kim, J., Kao, T., Detchprohm, T., Dupuis, R. D., Shen, S., Graham, S., & Choi, S. (2017). Thermal characterization of GaN vertical p-i-n diodes. In Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 (pp. 328-333). [7992489] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ITHERM.2017.7992489