Thermal design and optimization methodology for integrated power electronics modules

Ying Feng Pang, Elaine P. Scott, Jonah Zhou Chen, Karen A. Thole

Research output: Contribution to journalArticle

8 Scopus citations

Abstract

A methodology was developed and implemented to optimize the design layout for integrated power electronics modules (IPEMs) by considering both the electrical and thermal performances. This paper is primarily focused on the thermal aspects, which were analyzed using three-dimensional (3D) computational software tools. Implementation of the design methodology resulted in a 70 percent reduction in the common mode current, a 4 percent reduction in the size of the geometric footprint, and a 7°C reduction in the maximum temperature rise for the case studied, thus, providing an increase in the IPEM's overall performance

Original languageEnglish (US)
Pages (from-to)59-66
Number of pages8
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume127
Issue number1
DOIs
StatePublished - Mar 1 2005

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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