Thermal reliability design and optimization for multilayer composite electronic boards

Amir Khalilollahi, Oladipo Qnipede, Russell Lee Warley

Research output: Contribution to conferencePaper

2 Citations (Scopus)

Abstract

Boards made of composites are susceptible of structural failure or irreversible damage under thermally raised stresses. A thermal/structural finite element model is integrated in this study to enable the predictions of the temperature and stress distribution of vertically clamped parallel circuit boards that include series of symmetrically mounted heated electronic modules (chips). The board is modeled as a thin plate containing four heated flush rectangular areas that represent the electronic modules. The finite element model should be to able to accept the convection heat transfer on the board surface, heat generation in the modules, and directional conduction inside the board. A detailed 3-D CFD model is incorporated to predict the conjugate heat transfer coefficients that strongly affect the temperature distribution in the board and modules. Structural analyses are performed by a FE model that uses the heat transfer coefficients mentioned above, and structural elements capable of handling orthotropic material properties. The stress fields are obtained and studied for the models possessing two and there laminates with different fiber orientations, and inter-fiber angles. Appreciable differences in values of max stress intensity were observed as the fiber orientation and inter-fiber angle changed. The angular parameters in this study were guided by experimental design (DOE) concepts leading to a metainodel of the stress intensity in the board. The optimum design variables found by the equations of the metamodel.

Original languageEnglish (US)
Pages845-851
Number of pages7
DOIs
StatePublished - Jan 1 2005
Event2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005 - Orlando, FL, United States
Duration: Nov 5 2005Nov 11 2005

Other

Other2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005
CountryUnited States
CityOrlando, FL
Period11/5/0511/11/05

Fingerprint

Multilayers
Composite materials
Fiber reinforced materials
Heat transfer coefficients
Temperature distribution
Heat convection
Fibers
Heat generation
Design of experiments
Laminates
Stress concentration
Materials properties
Computational fluid dynamics
Hot Temperature
Networks (circuits)

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering

Cite this

Khalilollahi, A., Qnipede, O., & Warley, R. L. (2005). Thermal reliability design and optimization for multilayer composite electronic boards. 845-851. Paper presented at 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005, Orlando, FL, United States. https://doi.org/10.1115/IMECE2005-82560
Khalilollahi, Amir ; Qnipede, Oladipo ; Warley, Russell Lee. / Thermal reliability design and optimization for multilayer composite electronic boards. Paper presented at 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005, Orlando, FL, United States.7 p.
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Khalilollahi, A, Qnipede, O & Warley, RL 2005, 'Thermal reliability design and optimization for multilayer composite electronic boards', Paper presented at 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005, Orlando, FL, United States, 11/5/05 - 11/11/05 pp. 845-851. https://doi.org/10.1115/IMECE2005-82560

Thermal reliability design and optimization for multilayer composite electronic boards. / Khalilollahi, Amir; Qnipede, Oladipo; Warley, Russell Lee.

2005. 845-851 Paper presented at 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005, Orlando, FL, United States.

Research output: Contribution to conferencePaper

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Khalilollahi A, Qnipede O, Warley RL. Thermal reliability design and optimization for multilayer composite electronic boards. 2005. Paper presented at 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005, Orlando, FL, United States. https://doi.org/10.1115/IMECE2005-82560