Thermal reliability of copper alloy-diamond composites produced by field-assisted sintering technology

A. Rape, A. Kulkarni, B. Bhat, J. Singh

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

This paper highlights the thermal properties of copper-diamond composites fabricated by field assisted sintering technology. The samples were fabricated using a matrix of copper alloyed with silver and zirconium. Previous reports have shown that these samples possess high thermal conductivity. This work examines the thermal conductivity of the samples after being subjected to thermal cycling. Coefficient of thermal expansion is also reported in this work.

Original languageEnglish (US)
Pages (from-to)1241-1245
Number of pages5
JournalJournal of Composite Materials
Volume50
Issue number9
DOIs
StatePublished - Apr 1 2016

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Mechanics of Materials
  • Mechanical Engineering
  • Materials Chemistry

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