Thermal stress reduction and optimization for orthotropic composite boards

Amir Khalilollahi, Russell L. Warley

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Composite printed electronic boards are susceptible of structural failure or irreversible damage under thermally raised stresses. A thermal/structural finite element model is integrated in this study to enable the predictions of the temperature and stress distribution of vertically clamped parallel circuit boards that include series of symmetrically mounted heated electronic modules (chips). The board is modeled as a thin plate containing four heated flush rectangular areas that represent the electronic modules. The finite element model should be to able to accept the convection heat transfer on the board surface, heat generation in the modules, and directional conduction inside the board. A detailed 3-D CFD model is incorporated to predict the conjugate heat transfer coefficients that strongly affect the temperature distribution in the board and modules. Structural analyses are performed by a FE model that uses the heat transfer coefficients mentioned above, and structural elements capable of handling orthotropic material properties. The stress fields are obtained and compared for the models possessing different fiber orientations and fiber volume fractions. Appreciable differences in stress and thermal gradient fields were observed. The values of fiber volume fraction and fiber orientation at which to conduct analyses was guided by experimental design (DOE) ideas leading to a metamodel of the stress intensity and temperature gradient in the board which was used to represent the complied results of this study.

Original languageEnglish (US)
Title of host publicationProceedings of the ASME Summer Heat Transfer Conference, HT 2005
Pages267-272
Number of pages6
Volume4
DOIs
StatePublished - Dec 1 2005
Event2005 ASME Summer Heat Transfer Conference, HT 2005 - San Francisco, CA, United States
Duration: Jul 17 2005Jul 22 2005

Other

Other2005 ASME Summer Heat Transfer Conference, HT 2005
CountryUnited States
CitySan Francisco, CA
Period7/17/057/22/05

Fingerprint

Thermal stress
Composite materials
Fiber reinforced materials
Thermal gradients
Heat transfer coefficients
Volume fraction
Temperature distribution
Heat convection
Fibers
Heat generation
Design of experiments
Stress concentration
Materials properties
Computational fluid dynamics
Networks (circuits)

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Khalilollahi, A., & Warley, R. L. (2005). Thermal stress reduction and optimization for orthotropic composite boards. In Proceedings of the ASME Summer Heat Transfer Conference, HT 2005 (Vol. 4, pp. 267-272). [HT2005-72570] https://doi.org/10.1115/HT2005-72570
Khalilollahi, Amir ; Warley, Russell L. / Thermal stress reduction and optimization for orthotropic composite boards. Proceedings of the ASME Summer Heat Transfer Conference, HT 2005. Vol. 4 2005. pp. 267-272
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Khalilollahi, A & Warley, RL 2005, Thermal stress reduction and optimization for orthotropic composite boards. in Proceedings of the ASME Summer Heat Transfer Conference, HT 2005. vol. 4, HT2005-72570, pp. 267-272, 2005 ASME Summer Heat Transfer Conference, HT 2005, San Francisco, CA, United States, 7/17/05. https://doi.org/10.1115/HT2005-72570

Thermal stress reduction and optimization for orthotropic composite boards. / Khalilollahi, Amir; Warley, Russell L.

Proceedings of the ASME Summer Heat Transfer Conference, HT 2005. Vol. 4 2005. p. 267-272 HT2005-72570.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Khalilollahi A, Warley RL. Thermal stress reduction and optimization for orthotropic composite boards. In Proceedings of the ASME Summer Heat Transfer Conference, HT 2005. Vol. 4. 2005. p. 267-272. HT2005-72570 https://doi.org/10.1115/HT2005-72570