TY - GEN
T1 - Thermomechanical behavior of BME capacitors during binder burnout
AU - Kim, Hyo Tae
AU - Adair, James Hansell
AU - Lanagan, Michael T.
PY - 2001/10/1
Y1 - 2001/10/1
N2 - Recently, multilayer ceramic capacitor (MLCC) manufacturers have focused on replacing costly noble-metal electrodes with base-metal electrodes (BME), which affects all stages of the fabrication process. Binder removal is a critical step in the process and must be controlled to avoid delamination and deleterious electrode oxidation. Thus, the deformation behavior of BME-multilayer ceramic capacitors (MLCCs) during binder burnout is characterized using thermomechanical analysis (TMA), and results are compared to thermogravimetric analysis (TGA) data.
AB - Recently, multilayer ceramic capacitor (MLCC) manufacturers have focused on replacing costly noble-metal electrodes with base-metal electrodes (BME), which affects all stages of the fabrication process. Binder removal is a critical step in the process and must be controlled to avoid delamination and deleterious electrode oxidation. Thus, the deformation behavior of BME-multilayer ceramic capacitors (MLCCs) during binder burnout is characterized using thermomechanical analysis (TMA), and results are compared to thermogravimetric analysis (TGA) data.
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M3 - Article
AN - SCOPUS:0035497391
VL - 80
SP - 34
EP - 38
JO - Bulletin of the American Ceramic Society
JF - Bulletin of the American Ceramic Society
SN - 0002-7812
ER -