Recently, multilayer ceramic capacitor (MLCC) manufacturers have focused on replacing costly noble-metal electrodes with base-metal electrodes (BME), which affects all stages of the fabrication process. Binder removal is a critical step in the process and must be controlled to avoid delamination and deleterious electrode oxidation. Thus, the deformation behavior of BME-multilayer ceramic capacitors (MLCCs) during binder burnout is characterized using thermomechanical analysis (TMA), and results are compared to thermogravimetric analysis (TGA) data.
|Original language||English (US)|
|Number of pages||5|
|Specialist publication||American Ceramic Society Bulletin|
|State||Published - Oct 1 2001|
All Science Journal Classification (ASJC) codes
- Ceramics and Composites