@inproceedings{db341b8987e346d89a09a3e9a8c15935,
title = "Thermophysical properties of copper composites reinforced with negative CTE fillers",
abstract = "Copper reinforced with low Coefficient of Thermal Expansion (CTE) fillers such as carbon fibers or SiC particles have been investigated for several years. Such a material combines a high thermal conductivity with a low CTE. This work reports on first results which have been achieved by combining a copper matrix with a filler material exhibiting a negative CTE by using rapid sintering with the goal to reduce the resulting overall CTE but keeping a high thermal conductivity at a relatively low amount of filler. The used filler material is characterized by a negative CTE value in the range of -8 to -10 ppm/K. By using a powder metallurgical approach whereby mixing Cu with the negative filler a composite with tailorable CTE can be prepared. The produced composites have been investigated with respect to their thermal expansion behavior. A promising material with a CTE in the range of 8 to 12 ppm/K at room temperature and still acceptable thermal conductivity has been obtained.",
author = "E. Neubauer and I. Smid and G. Requena and Degischer, {H. P.} and P. Angerer",
year = "2006",
language = "English (US)",
isbn = "9780976205760",
series = "Advances in Powder Metallurgy and Particulate Materials - 2006, Proceedings of the 2006 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2006",
pages = "937--943",
booktitle = "Advances in Powder Metallurgy and Particulate Materials - 2006, Proceedings of the 2006 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2006",
note = "2006 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2006 ; Conference date: 18-06-2006 Through 21-06-2006",
}