Thermophysical properties of copper composites reinforced with negative CTE fillers

E. Neubauer, I. Smid, G. Requena, H. P. Degischer, P. Angerer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Copper reinforced with low Coefficient of Thermal Expansion (CTE) fillers such as carbon fibers or SiC particles have been investigated for several years. Such a material combines a high thermal conductivity with a low CTE. This work reports on first results which have been achieved by combining a copper matrix with a filler material exhibiting a negative CTE by using rapid sintering with the goal to reduce the resulting overall CTE but keeping a high thermal conductivity at a relatively low amount of filler. The used filler material is characterized by a negative CTE value in the range of -8 to -10 ppm/K. By using a powder metallurgical approach whereby mixing Cu with the negative filler a composite with tailorable CTE can be prepared. The produced composites have been investigated with respect to their thermal expansion behavior. A promising material with a CTE in the range of 8 to 12 ppm/K at room temperature and still acceptable thermal conductivity has been obtained.

Original languageEnglish (US)
Title of host publicationAdvances in Powder Metallurgy and Particulate Materials - 2006, Proceedings of the 2006 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2006
Pages937-943
Number of pages7
StatePublished - Dec 1 2006
Event2006 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2006 - San Diego, CA, United States
Duration: Jun 18 2006Jun 21 2006

Publication series

NameAdvances in Powder Metallurgy and Particulate Materials - 2006, Proceedings of the 2006 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2006

Other

Other2006 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2006
CountryUnited States
CitySan Diego, CA
Period6/18/066/21/06

All Science Journal Classification (ASJC) codes

  • Metals and Alloys
  • Surfaces and Interfaces

Fingerprint Dive into the research topics of 'Thermophysical properties of copper composites reinforced with negative CTE fillers'. Together they form a unique fingerprint.

Cite this