Thin film capacitors embedded into high density printed circuit boards

Angus I. Kingon, Taeyun Kim, Paula Vilarinho, Jon Paul Maria, Robert T. Crosswell

Research output: Contribution to journalConference article

Abstract

This paper describes an approach for embedding high value, thin film capacitors into high density multilayer printed circuit boards. Pb0.85La0.15(Zr0.52Ti0.48)0.96 O3 thin films are prepared by chemical solution deposition on 50 μm Ni-coated Cu foils. Capacitance density and loss tangent values range between 300 and 400 nF/cm2 and 0.01 and 0.02 from 1 to 1000 kHz respectively. Integration of these foils into a standard HDI process. The capacitance densities represent a 2 to 3 order of magnitude improvement over currently available embedded capacitor technologies for polymeric packages.

Original languageEnglish (US)
Pages (from-to)448-451
Number of pages4
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4587
StatePublished - Dec 1 2001
Event2001 International Symposium on Microelectronics - Baltimore, MD, United States
Duration: Oct 9 2001Oct 11 2001

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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