Thin film MLCC

Michael Randall, Dan Skamser, Tony Kinard, Javaid Qazi, Aziz Tajuddin, Susan Trolier-Mckinstry, Clive Randall, Song Won Ko, Tanawadee Dechakupt

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations


An ever-increasing need for higher capacitance per unit volume multilayer ceramic capacitors (MLCC) has lead to dielectric thicknesses and internal electrode thicknesses in state-of-the-art MLCC below 1 μm using traditional thick film MLCC manufacturing technologies. Traditional MLCC manufacturing technology has surprisingly evolved to this level of capability and beyond. The topic of how thin this technology can go has been the subject of much debate. This paper discusses the state-of-the-art of traditional MLCC technology and compares this technology to potential thin film manufacturing techniques for MLCC. The practicality of thin film technology for MLCC manufacture is discussed with respect to materials sets, potential fabrication technologies and associated limitations, and design philosophies. Also considered are the impact of general trends in the electronics industry, anticipated evolution of MLCC form factor and general device requirements with respect to thin film technology as a potentially viable future MLCC fabrication method.

Original languageEnglish (US)
Title of host publicationCARTS USA 2007
Number of pages13
StatePublished - 2007
Event27th Symposium for Passive Components, CARTS-USA 2007 - Albuquerque, NM, United States
Duration: Mar 26 2007Mar 29 2007

Publication series

NameCARTS USA 2007


Other27th Symposium for Passive Components, CARTS-USA 2007
Country/TerritoryUnited States
CityAlbuquerque, NM

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality
  • Materials Science(all)


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