An ever-increasing need for higher capacitance per unit volume multilayer ceramic capacitors (MLCC) has lead to dielectric thicknesses and internal electrode thicknesses in state-of-the-art MLCC below 1 μm using traditional thick film MLCC manufacturing technologies. Traditional MLCC manufacturing technology has surprisingly evolved to this level of capability and beyond. The topic of how thin this technology can go has been the subject of much debate. This paper discusses the state-of-the-art of traditional MLCC technology and compares this technology to potential thin film manufacturing techniques for MLCC. The practicality of thin film technology for MLCC manufacture is discussed with respect to materials sets, potential fabrication technologies and associated limitations, and design philosophies. Also considered are the impact of general trends in the electronics industry, anticipated evolution of MLCC form factor and general device requirements with respect to thin film technology as a potentially viable future MLCC fabrication method.