Thin film thermoelectric metal-organic framework with high seebeck coefficient and low thermal conductivity

Kristopher J. Erickson, François Léonard, Vitalie Stavila, Michael E. Foster, Catalin D. Spataru, Reese E. Jones, Brian M. Foley, Patrick E. Hopkins, Mark D. Allendorf, A. Alec Talin

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117 Scopus citations

Abstract

A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal-organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.

Original languageEnglish (US)
Pages (from-to)3453-3459
Number of pages7
JournalAdvanced Materials
Volume27
Issue number22
DOIs
StatePublished - Jun 1 2015

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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    Erickson, K. J., Léonard, F., Stavila, V., Foster, M. E., Spataru, C. D., Jones, R. E., Foley, B. M., Hopkins, P. E., Allendorf, M. D., & Talin, A. A. (2015). Thin film thermoelectric metal-organic framework with high seebeck coefficient and low thermal conductivity. Advanced Materials, 27(22), 3453-3459. https://doi.org/10.1002/adma.201501078