Three-dimensional cache design exploration using 3DCacti

Yuh Fang Tsai, Yuan Xie, N. Vijaykrishnan, Mary Jane Irwin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

84 Scopus citations

Abstract

As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a way to mitigate the interconnect challenges. In this paper, we explore the architectural design of cache memories using 3D circuits. We present a delay and energy model, 3DCacti, to explore different 3D design options of partitioning a cache. The tool allows partitioning of the cache across different device layers at various levels of granularity. The tool has been validated by comparing its results with those obtained from circuit simulation of custom 3D layouts. We also explore the effects of various cache partitioning parameters and 3D technology parameters on delay and energy to demonstrate the utility of the tool.

Original languageEnglish (US)
Title of host publicationProceedings - 2005 IEEE International Conference on Computer Design
Subtitle of host publicationVLSI in Computers and Processors, ICCD 2005
Pages519-524
Number of pages6
DOIs
StatePublished - Dec 1 2005
Event2005 IEEE International Conference on Computer Design: VLSI in Computers and Processors, ICCD 2005 - San Jose, CA, United States
Duration: Oct 2 2005Oct 5 2005

Publication series

NameProceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors
Volume2005
ISSN (Print)1063-6404

Other

Other2005 IEEE International Conference on Computer Design: VLSI in Computers and Processors, ICCD 2005
CountryUnited States
CitySan Jose, CA
Period10/2/0510/5/05

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Three-dimensional cache design exploration using 3DCacti'. Together they form a unique fingerprint.

Cite this