Three-dimensional micrometer-scale modeling of quenching in high-aspect-ratio YBa2Cu3O7-δ coated conductor tapes-Part II: Influence of geometric and material properties and implications for conductor engineering and magnet design

Wan Kan Chan, Justin Schwartz

Research output: Contribution to journalArticle

32 Scopus citations

Abstract

YBa2Cu3O7-δ (YBCO) coated conductors (CCs) show great promise for applications, but due to a very slow normal-zone propagation velocity (NZPV), quench detection and protection in YBCO magnets may be difficult. Present YBCO CCs have been developed with a primary focus on maximizing the critical current density for elevated-temperature low-field or low-temperature high-field applications. As the market for magnet applications progresses, it becomes important to consider design parameters such as the thicknesses and properties of all YBCO CC components, with the intent of considering quench-related behaviors as an integral part of the conductor and magnet design processes. Thus, it is important to know the impacts of conductor parameters on quench behavior. Considering that the YBCO layer itself is on the order of a micrometer in thickness, quench behavior must also be considered at this scale length. Here, the highly accurate experimentally validated micrometer-scale 3-D tape model reported in Part I is used to study how variations in CC geometry and material properties affect quench behavior, including the NZPV, hot-spot temperature, and minimum quench energy. The parametric variations focus on quantities that can be most readily modified by CC manufacturers. Based on simulation results, the relative sensitivities of the quench quantities to the parametric variations are calculated to identify which CC design parameters are most impactful on quench behavior. The implications of these results for quench detection and protection are discussed.

Original languageEnglish (US)
Article number6061946
Pages (from-to)3628-3634
Number of pages7
JournalIEEE Transactions on Applied Superconductivity
Volume21
Issue number6
DOIs
Publication statusPublished - Dec 1 2011

    Fingerprint

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this