Tin-based solder bonding for MEMS fabrication and packaging applications

A. Goyal, J. Cheong, S. Tadigadapa

Research output: Contribution to journalArticle

22 Citations (Scopus)

Abstract

This paper presents a tin-based solder bonding technology for microelectromechanical systems (MEMS) fabrication and packaging applications. Electroplated tin on a lithographically patterned seed layer of chrome-gold was used for bonding two Pyrex substrates. Average values of the tensile strength and the shear strength obtained were 14.6 MPa and 5.78 MPa, respectively. Shear strength data were analysed using Weibull statistics, which revealed presence of multiple failure mechanisms and an average value of β greater than 3. Failure occurred not only at the tin-tin bond interface but also at the tin-chrome interface. Highest values for the bond strength were obtained when the samples failed due to delamination at the tin-tin bond interface. Acoustic images of the bonded interface were used to qualitatively study the degradation in the bond interface when subjected to tensile stresses. Hermetic testing of the samples using a conventional He-leak detector showed leak integrity of better than 1 × 10-11mbar 1 s-1.

Original languageEnglish (US)
Pages (from-to)819-825
Number of pages7
JournalJournal of Micromechanics and Microengineering
Volume14
Issue number6
DOIs
StatePublished - Jun 1 2004

Fingerprint

Tin
Soldering alloys
MEMS
Packaging
Fabrication
Shear strength
Delamination
Tensile stress
Gold
Seed
Tensile strength
Acoustics
Statistics
Detectors
Degradation
Testing
Substrates

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Goyal, A. ; Cheong, J. ; Tadigadapa, S. / Tin-based solder bonding for MEMS fabrication and packaging applications. In: Journal of Micromechanics and Microengineering. 2004 ; Vol. 14, No. 6. pp. 819-825.
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Tin-based solder bonding for MEMS fabrication and packaging applications. / Goyal, A.; Cheong, J.; Tadigadapa, S.

In: Journal of Micromechanics and Microengineering, Vol. 14, No. 6, 01.06.2004, p. 819-825.

Research output: Contribution to journalArticle

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AB - This paper presents a tin-based solder bonding technology for microelectromechanical systems (MEMS) fabrication and packaging applications. Electroplated tin on a lithographically patterned seed layer of chrome-gold was used for bonding two Pyrex substrates. Average values of the tensile strength and the shear strength obtained were 14.6 MPa and 5.78 MPa, respectively. Shear strength data were analysed using Weibull statistics, which revealed presence of multiple failure mechanisms and an average value of β greater than 3. Failure occurred not only at the tin-tin bond interface but also at the tin-chrome interface. Highest values for the bond strength were obtained when the samples failed due to delamination at the tin-tin bond interface. Acoustic images of the bonded interface were used to qualitatively study the degradation in the bond interface when subjected to tensile stresses. Hermetic testing of the samples using a conventional He-leak detector showed leak integrity of better than 1 × 10-11mbar 1 s-1.

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