Towards batch fabrication of bundled carbon nanotube thermal sensors

C. K.M. Fung, V. T.S. Wong, W. J. Li

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Scopus citations

Abstract

A new approach for batch fabrication of carbon nanotubes (CNT) based MEMS thermal sensor was developed using AC electrophoretic manipulation of MWNT bundles on a silicon substrate. Based on this technique, CNT were successfully and repeatably manipulated by AC electrophoresis to form resistive elements between Au microelectrodes. We have preliminarily proved the feasibility to batch assembly of CNT devices with greater than 70% success rate. Besides, the devices were demonstrated to potentially serve as novel thermal sensors. We have measured the temperature coefficient of resistance (TCR) of these MWNT-based micro sensors and also integrated them into constant current configuration for dynamic characterization. The I-V measurements of the resulting devices revealed that their power consumption were in the μW range. Based on these experimental evidences and our proposed new approach, a feasible batch manufacturable scheme for functional CNT based thermal sensors is suggested which will dramatically reduce production costs of nano sensing devices and potentially enable fully automated assembly of CNT-based devices.

Original languageEnglish (US)
Title of host publication2003 3rd IEEE Conference on Nanotechnology, IEEE-NANO 2003 - Proceedings
PublisherIEEE Computer Society
Pages866-869
Number of pages4
ISBN (Electronic)0780379764
DOIs
StatePublished - Jan 1 2003
Event2003 3rd IEEE Conference on Nanotechnology, IEEE-NANO 2003 - San Francisco, United States
Duration: Aug 12 2003Aug 14 2003

Publication series

NameProceedings of the IEEE Conference on Nanotechnology
Volume2
ISSN (Print)1944-9399
ISSN (Electronic)1944-9380

Other

Other2003 3rd IEEE Conference on Nanotechnology, IEEE-NANO 2003
CountryUnited States
CitySan Francisco
Period8/12/038/14/03

All Science Journal Classification (ASJC) codes

  • Bioengineering
  • Electrical and Electronic Engineering
  • Materials Chemistry
  • Condensed Matter Physics

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