Transient liquid phase bonding of commercially pure iron using Cu and Au-12Ge interlayer

A. H.M.E. Rahman, M. N. Cavalli

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Abstract

Commercially pure Fe was diffusion bonded using Cu (25 μm) and Au-12Ge eutectic interlayer (100 μm). At 1000-1090 °C bonding temperature and 10-30. h bonding time, Cu interlayer did not diffuse completely into the base metal. The compositions of residual interlayer and base metal at the interface were limited by the solubility range of e{open}-Cu and γ-Fe. Residual Cu interlayer was also observed after bonding at 1100 °C for 3-4. h. No residual Cu was found after 5. h bonding time at 1100 °C; however, porous microstructure was observed along the bond centerline. Cu diffused predominantly along austenite grain boundaries in all bonding conditions. Fe was diffusion bonded using Au-12Ge interlayer at 900-990 °C for 1-15. h. At 900 °C for 1. h the residual interlayer thickness was 12.6 μm; the thickness decreased to 6 μm when bonding time was increased to 10. h. Fingerprint-like microstructure was observed in the residual interlayer. At 920 °C for 15. h, the interlayer completely diffused into the base metal in some areas and was retained in some areas. The thickness of the residual interlayer was 1.25-3.8 μm. Dispersed Au-rich particles were observed in the base metal near interface. The highest ultimate tensile strengths obtained for the bonded Fe were 291 ± 2. MPa using a Cu interlayer at 1030 °C for 10. h and 315 ± 4. MPa using a Au-12Ge interlayer at 950 °C for 15 h.

Original languageEnglish (US)
Pages (from-to)6-12
Number of pages7
JournalMaterials Science and Engineering A
Volume545
DOIs
Publication statusPublished - May 30 2012

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All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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