Tunable interdigital capacitors at microwave frequency

Jeremiah P. Turpin, Oleg Maksimov, Mark Andrew Fanton, Volker D. Heydemann, Joshua Alexander Robinson, Steven Edward Perini, Michael T. Lanagan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

As applications for integrated structures advance to higher frequencies, the electrical properties of materials must be well characterized. An interdigital capacitor (IDC) structure was designed, fabricated and tested for dielectric constant characterization of substrates and films in the 1 to 20 GHz range. A mathematical model based on the physical geometry of the capacitor was implemented and an experimental technique for measuring the actual capacitance was developed. Microwave characterization of the IDC with a vector network analyzer and simulations in CST Microwave Studio were compared with the analytical results for determining capacitance. The dielectric constant of the substrate was derived from the expression for capacitance and calculation of the properties of a dielectric layer on the surface of the substrate was performed by a similar procedure. IDCs lithographed on lanthanum aluminum oxide and magnesium oxide substrates were coated with a barium strontium titanate films and were tested under a DC voltage bias to measure the shift in capacitance due to the change in permittivity under the electric field. The capacitance change of IDCs as a function of bias voltage was investigated and the results were assessed for a final goal of creating tunable capacitors for microwave applications.

Original languageEnglish (US)
Title of host publication4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008
Pages148-154
Number of pages7
StatePublished - Dec 1 2008
Event4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2008 - Munich, Germany
Duration: Apr 21 2008Apr 24 2008

Publication series

Name4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008

Other

Other4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2008
CountryGermany
CityMunich
Period4/21/084/24/08

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Ceramics and Composites

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