Ultra-thin, flexible electronics for measurements of tape-spring hinge behavior

Yao Yao, Guanghui Li, Xin Ning

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

As deployable structures are more commonly used in space exploration, new in-situ structural monitoring technologies for such structures beyond traditional approaches are needed. In this study, we provide design, fabrication, and materials of an ultra-thin, soft electronic skin, which serves as a sensor system for in-situ structure validation of a deployable tape-spring hinge. Both the dynamic release behavior and the quasi-static release behavior of the structure are measured and monitored by the fabricated devices. We are able to measure vibration frequency, surface orientation, and induced strain in the deformed region that can be used to reconstruct the folding and deployment behavior of the structure.

Original languageEnglish (US)
Title of host publicationAIAA Scitech 2021 Forum
PublisherAmerican Institute of Aeronautics and Astronautics Inc, AIAA
Pages1-7
Number of pages7
ISBN (Print)9781624106095
DOIs
StatePublished - 2021
EventAIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2021 - Virtual, Online
Duration: Jan 11 2021Jan 15 2021

Publication series

NameAIAA Scitech 2021 Forum

Conference

ConferenceAIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2021
CityVirtual, Online
Period1/11/211/15/21

All Science Journal Classification (ASJC) codes

  • Aerospace Engineering

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