Ultrasonic attenuation effects associated with the physical modeling of adhesive bonds

Paul A. Meyer, Joseph Lawrence Rose

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

The purpose of this work is to examine the effects of selected attenuation functions in adhesive bond modeling problems so that the attenuation in signal processing and interpretation can be treated adequately, and also to determine the significance of attenuation in evaluating bond integrity. Bond models are presently being used to study such problems as improper substrate surface preparation, improper adhesive cure, and chemical segregation of the adhesive. Specific attenuation functions used include some experimentally measured values for real materials, such as polystyrene, Lucite, and rubber, and also a few hypothesized resonant functions based on observed attenuation phenomena in polymeric materials. Results indicate that attenuation effects do not substantially alter the ultrasonic reflection at frequencies lower than 7 MHz. As a result of the study, however, it becomes possible either to eliminate or to amplify attenuation effects by selecting processing techniques for bond inspection. It is also possible to study more sophisticated adhesive bond models with more accurate attenuation functions that could ultimately lead to improved criteria for transducer and signal-processing selection.

Original languageEnglish (US)
Pages (from-to)3705-3712
Number of pages8
JournalJournal of Applied Physics
Volume48
Issue number9
DOIs
StatePublished - Dec 1 1977

Fingerprint

adhesives
ultrasonics
attenuation
signal processing
rubber
polymethyl methacrylate
integrity
inspection
polystyrene
transducers
low frequencies
preparation

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)
  • Physics and Astronomy(all)

Cite this

Meyer, Paul A. ; Rose, Joseph Lawrence. / Ultrasonic attenuation effects associated with the physical modeling of adhesive bonds. In: Journal of Applied Physics. 1977 ; Vol. 48, No. 9. pp. 3705-3712.
@article{0605fa6926fa4773abb005a3f86a1d44,
title = "Ultrasonic attenuation effects associated with the physical modeling of adhesive bonds",
abstract = "The purpose of this work is to examine the effects of selected attenuation functions in adhesive bond modeling problems so that the attenuation in signal processing and interpretation can be treated adequately, and also to determine the significance of attenuation in evaluating bond integrity. Bond models are presently being used to study such problems as improper substrate surface preparation, improper adhesive cure, and chemical segregation of the adhesive. Specific attenuation functions used include some experimentally measured values for real materials, such as polystyrene, Lucite, and rubber, and also a few hypothesized resonant functions based on observed attenuation phenomena in polymeric materials. Results indicate that attenuation effects do not substantially alter the ultrasonic reflection at frequencies lower than 7 MHz. As a result of the study, however, it becomes possible either to eliminate or to amplify attenuation effects by selecting processing techniques for bond inspection. It is also possible to study more sophisticated adhesive bond models with more accurate attenuation functions that could ultimately lead to improved criteria for transducer and signal-processing selection.",
author = "Meyer, {Paul A.} and Rose, {Joseph Lawrence}",
year = "1977",
month = "12",
day = "1",
doi = "10.1063/1.324285",
language = "English (US)",
volume = "48",
pages = "3705--3712",
journal = "Journal of Applied Physics",
issn = "0021-8979",
publisher = "American Institute of Physics Publising LLC",
number = "9",

}

Ultrasonic attenuation effects associated with the physical modeling of adhesive bonds. / Meyer, Paul A.; Rose, Joseph Lawrence.

In: Journal of Applied Physics, Vol. 48, No. 9, 01.12.1977, p. 3705-3712.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Ultrasonic attenuation effects associated with the physical modeling of adhesive bonds

AU - Meyer, Paul A.

AU - Rose, Joseph Lawrence

PY - 1977/12/1

Y1 - 1977/12/1

N2 - The purpose of this work is to examine the effects of selected attenuation functions in adhesive bond modeling problems so that the attenuation in signal processing and interpretation can be treated adequately, and also to determine the significance of attenuation in evaluating bond integrity. Bond models are presently being used to study such problems as improper substrate surface preparation, improper adhesive cure, and chemical segregation of the adhesive. Specific attenuation functions used include some experimentally measured values for real materials, such as polystyrene, Lucite, and rubber, and also a few hypothesized resonant functions based on observed attenuation phenomena in polymeric materials. Results indicate that attenuation effects do not substantially alter the ultrasonic reflection at frequencies lower than 7 MHz. As a result of the study, however, it becomes possible either to eliminate or to amplify attenuation effects by selecting processing techniques for bond inspection. It is also possible to study more sophisticated adhesive bond models with more accurate attenuation functions that could ultimately lead to improved criteria for transducer and signal-processing selection.

AB - The purpose of this work is to examine the effects of selected attenuation functions in adhesive bond modeling problems so that the attenuation in signal processing and interpretation can be treated adequately, and also to determine the significance of attenuation in evaluating bond integrity. Bond models are presently being used to study such problems as improper substrate surface preparation, improper adhesive cure, and chemical segregation of the adhesive. Specific attenuation functions used include some experimentally measured values for real materials, such as polystyrene, Lucite, and rubber, and also a few hypothesized resonant functions based on observed attenuation phenomena in polymeric materials. Results indicate that attenuation effects do not substantially alter the ultrasonic reflection at frequencies lower than 7 MHz. As a result of the study, however, it becomes possible either to eliminate or to amplify attenuation effects by selecting processing techniques for bond inspection. It is also possible to study more sophisticated adhesive bond models with more accurate attenuation functions that could ultimately lead to improved criteria for transducer and signal-processing selection.

UR - http://www.scopus.com/inward/record.url?scp=0017532114&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0017532114&partnerID=8YFLogxK

U2 - 10.1063/1.324285

DO - 10.1063/1.324285

M3 - Article

VL - 48

SP - 3705

EP - 3712

JO - Journal of Applied Physics

JF - Journal of Applied Physics

SN - 0021-8979

IS - 9

ER -