ULTRASONIC SIGNAL-PROCESSING CONCEPTS FOR MEASURING THE THICKNESS OF THIN LAYERS.

Joseph Lawrence Rose, Paul A. Meyer

Research output: Contribution to specialist publicationArticle

13 Citations (Scopus)

Abstract

A systematic approach is presented for developing ultrasonic signal-processing procedures that can be used to measure the thickness of thin layers. Such preprocessing procedures as time between echoes, peak-to-peak amplitude analysis, and Fourier transform techniques are considered in the paper. The work can be extended to such areas of study as the property evaluation of thin planar defects in metals, flaw characterization analysis in an adhesively bonded system, and also applied to the fatigue crack analysis problem, including an evaluation of possible corrosion and sealer properties in the thin layer.

Original languageEnglish (US)
Volume32
No12
Specialist publicationMaterials Evaluation
StatePublished - Jan 1 1974

Fingerprint

Signal processing
Ultrasonics
Defects
Fourier transforms
Metals
Corrosion
Fatigue cracks

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Rose, Joseph Lawrence ; Meyer, Paul A. / ULTRASONIC SIGNAL-PROCESSING CONCEPTS FOR MEASURING THE THICKNESS OF THIN LAYERS. In: Materials Evaluation. 1974 ; Vol. 32, No. 12.
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ULTRASONIC SIGNAL-PROCESSING CONCEPTS FOR MEASURING THE THICKNESS OF THIN LAYERS. / Rose, Joseph Lawrence; Meyer, Paul A.

In: Materials Evaluation, Vol. 32, No. 12, 01.01.1974.

Research output: Contribution to specialist publicationArticle

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