ULTRASONIC SIGNAL-PROCESSING CONCEPTS FOR MEASURING THE THICKNESS OF THIN LAYERS.

Joseph Lawrence Rose, Paul A. Meyer

Research output: Contribution to specialist publicationArticle

13 Scopus citations

Abstract

A systematic approach is presented for developing ultrasonic signal-processing procedures that can be used to measure the thickness of thin layers. Such preprocessing procedures as time between echoes, peak-to-peak amplitude analysis, and Fourier transform techniques are considered in the paper. The work can be extended to such areas of study as the property evaluation of thin planar defects in metals, flaw characterization analysis in an adhesively bonded system, and also applied to the fatigue crack analysis problem, including an evaluation of possible corrosion and sealer properties in the thin layer.

Original languageEnglish (US)
Volume32
No.12
Specialist publicationMaterials Evaluation
Publication statusPublished - Jan 1 1974

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All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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