Abstract
A systematic approach is presented for developing ultrasonic signal-processing procedures that can be used to measure the thickness of thin layers. Such preprocessing procedures as time between echoes, peak-to-peak amplitude analysis, and Fourier transform techniques are considered in the paper. The work can be extended to such areas of study as the property evaluation of thin planar defects in metals, flaw characterization analysis in an adhesively bonded system, and also applied to the fatigue crack analysis problem, including an evaluation of possible corrosion and sealer properties in the thin layer.
| Original language | English (US) |
|---|---|
| Volume | 32 |
| No | 12 |
| Specialist publication | Materials Evaluation |
| State | Published - Jan 1 1974 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering
Cite this
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ULTRASONIC SIGNAL-PROCESSING CONCEPTS FOR MEASURING THE THICKNESS OF THIN LAYERS. / Rose, Joseph Lawrence; Meyer, Paul A.
In: Materials Evaluation, Vol. 32, No. 12, 01.01.1974.Research output: Contribution to specialist publication › Article
TY - GEN
T1 - ULTRASONIC SIGNAL-PROCESSING CONCEPTS FOR MEASURING THE THICKNESS OF THIN LAYERS.
AU - Rose, Joseph Lawrence
AU - Meyer, Paul A.
PY - 1974/1/1
Y1 - 1974/1/1
N2 - A systematic approach is presented for developing ultrasonic signal-processing procedures that can be used to measure the thickness of thin layers. Such preprocessing procedures as time between echoes, peak-to-peak amplitude analysis, and Fourier transform techniques are considered in the paper. The work can be extended to such areas of study as the property evaluation of thin planar defects in metals, flaw characterization analysis in an adhesively bonded system, and also applied to the fatigue crack analysis problem, including an evaluation of possible corrosion and sealer properties in the thin layer.
AB - A systematic approach is presented for developing ultrasonic signal-processing procedures that can be used to measure the thickness of thin layers. Such preprocessing procedures as time between echoes, peak-to-peak amplitude analysis, and Fourier transform techniques are considered in the paper. The work can be extended to such areas of study as the property evaluation of thin planar defects in metals, flaw characterization analysis in an adhesively bonded system, and also applied to the fatigue crack analysis problem, including an evaluation of possible corrosion and sealer properties in the thin layer.
UR - http://www.scopus.com/inward/record.url?scp=0016329092&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0016329092&partnerID=8YFLogxK
M3 - Article
AN - SCOPUS:0016329092
VL - 32
JO - Materials Evaluation
JF - Materials Evaluation
SN - 0025-5327
ER -