Ultrathin slices of ferroelectric domain-patterned lithium niobate by crystal ion slicing

David A. Scrymgeour, Venkat Gopalan, Tony E. Haynes, Miguel Levy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

We report the successful fabrication of 6 μm thick slices from a ferroelectric domain microengineered LiNbO3 wafer device using the crystal ion slicing technique. The device was created by micropatterning ferroelectric domains in a bulk 0.3 mm thick wafer of z-cut LiNbO3, followed by ion-implanting with 3.8 MeV He+ ions to a fluence 5 × 10+16 ions/cm2 to create a damage layer at a well defined depth from the surface. Etching away this damaged layer in dilute hydrofluoric acid results in a liftoff of the top slice in which the ferroelectric domain patterns are left intact. The influence of annealing conditions on liftoff time and depth of etch lines was studied. Helium-Neon laser light was successfully coupled into the device. Due to unintentional breakage of the polished input and output faces, the electro-optic scanning performance has not been characterized so far.

Original languageEnglish (US)
Title of host publicationWafer Bonding and Thinning Techniques for Materials Integration
PublisherMaterials Research Society
Pages121-126
Number of pages6
ISBN (Print)1558996176, 9781558996175
DOIs
StatePublished - 2001
Event2001 MRS Spring Meeting - San Franciso, CA, United States
Duration: Apr 16 2001Apr 20 2001

Publication series

NameMaterials Research Society Symposium Proceedings
Volume681
ISSN (Print)0272-9172

Other

Other2001 MRS Spring Meeting
CountryUnited States
CitySan Franciso, CA
Period4/16/014/20/01

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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