@inproceedings{55e3a00b75864ce19ce01ca52120ff78,
title = "Ultrathin slices of ferroelectric domain-patterned lithium niobate by crystal ion slicing",
abstract = "We report the successful fabrication of 6 μm thick slices from a ferroelectric domain microengineered LiNbO3 wafer device using the crystal ion slicing technique. The device was created by micropatterning ferroelectric domains in a bulk 0.3 mm thick wafer of z-cut LiNbO3, followed by ion-implanting with 3.8 MeV He+ ions to a fluence 5 × 10+16 ions/cm2 to create a damage layer at a well defined depth from the surface. Etching away this damaged layer in dilute hydrofluoric acid results in a liftoff of the top slice in which the ferroelectric domain patterns are left intact. The influence of annealing conditions on liftoff time and depth of etch lines was studied. Helium-Neon laser light was successfully coupled into the device. Due to unintentional breakage of the polished input and output faces, the electro-optic scanning performance has not been characterized so far.",
author = "Scrymgeour, {David A.} and Venkat Gopalan and Haynes, {Tony E.} and Miguel Levy",
year = "2001",
doi = "10.1557/proc-681-i6.3",
language = "English (US)",
isbn = "1558996176",
series = "Materials Research Society Symposium Proceedings",
publisher = "Materials Research Society",
pages = "121--126",
booktitle = "Wafer Bonding and Thinning Techniques for Materials Integration",
address = "United States",
note = "2001 MRS Spring Meeting ; Conference date: 16-04-2001 Through 20-04-2001",
}