Using Bayesian analysis to refine the measurement of the innovative capacities of engineers

Daniel M. Ferguson, Diane D. Navin, Michael L. Thompson, Amy D. Phillips, Matthew W. Ohland, Kathryn W. Jablokow

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this research-to-practice paper we provide the context for our research and review our process for conducting our engineering innovativeness factor analysis using Bayesian statistical approaches rather than using the traditional principal components analysis (PCA). Our purpose in discussing this analysis approach is to demonstrate that we found the Bayesian analysis approach to be a superior way to refine factors and reduce survey items when developing our instrument for assessment of engineering innovativeness characteristics.

Original languageEnglish (US)
Title of host publicationFrontiers in Education
Subtitle of host publicationFostering Innovation Through Diversity, FIE 2018 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538611739
DOIs
StatePublished - Mar 4 2019
Event48th Frontiers in Education Conference, FIE 2018 - San Jose, United States
Duration: Oct 3 2018Oct 6 2018

Publication series

NameProceedings - Frontiers in Education Conference, FIE
Volume2018-October
ISSN (Print)1539-4565

Conference

Conference48th Frontiers in Education Conference, FIE 2018
CountryUnited States
CitySan Jose
Period10/3/1810/6/18

All Science Journal Classification (ASJC) codes

  • Software
  • Education
  • Computer Science Applications

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  • Cite this

    Ferguson, D. M., Navin, D. D., Thompson, M. L., Phillips, A. D., Ohland, M. W., & Jablokow, K. W. (2019). Using Bayesian analysis to refine the measurement of the innovative capacities of engineers. In Frontiers in Education: Fostering Innovation Through Diversity, FIE 2018 - Conference Proceedings [8658698] (Proceedings - Frontiers in Education Conference, FIE; Vol. 2018-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/FIE.2018.8658698